National Yang Ming Chiao Tung University

Yu Chia Chiu

YewChung Sermon Wu

Jen-Li Hu

Tai-Min Chang

The present invention related to a method for manufacturing a thermal dissipation substrate and a thermal dissipation substrate. The method includes steps of: (a) providing a substrate body having a surface; (b) forming a plurality of concave regions on the surface; and (c) filling the plurality of concave regions with a plurality of diamond materials. The thermal dissipation substrate includes: a substrate having a surface at a first horizontal; a plurality of regions formed on the surface at a second horizontal; and a plurality of diamond materials having a relatively high thermal coefficient and disposed on the plurality of regions.

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Hsinchu, Taiwan

Yu Chia Chiu