Taiwan Semiconductor Manufacturing Comp. Ltd.

Realtek Semiconductor Inc.

Yu-Chi Tsai

Yung-Chang Huang

You-Fu Chen

Chu-Ting Chang

Chueh-Chi Kuo

Jih-Churng Twu

Hom-Chung Lin

Yi-Jen Wu

Chih-Yuan Cheng

Chin-Yun Chen

Tai-Hsiang Lin

Wen-tsung Huang

Yi-Hsuan Huang

A fingerprint recognition device includes a memory and a processor. The memory is configured to store at least one command. The processor is configured to read the at least one command to execute following steps: dividing a fingerprint image into a plurality of sub-areas; classifying the plurality of sub-areas into a plurality of high-quality areas and a plurality of low-quality areas according to a grayscale value ratio of the plurality of sub-areas; obtaining a first feature sample of the plurality of high-quality areas; obtaining a second feature sample of the plurality of low-quality areas, wherein a number of the first feature sample is larger than a number of the second feature sample; and outputting the first feature sample and the second feature sample.

Fingerprint recognition device and fingerprint recognition method

An electrostatic substrate holder for use in an extreme ultraviolet radiation lithography system includes a substrate receiving surface having a plurality of gas passages in fluid communication with a variable gas pressure pump. Varying the pressure in a void space between the backside of the substrate and the substrate receiving surface of the substrate holder promotes removal of non-gaseous materials within the void space between the backside of the substrate and the substrate receiving surface of the substrate holder.

Substrate holder and methods of use

A method for annealing a wafer includes loading the wafer to a fork of a delivering robot in an annealing apparatus, wherein the wafer is in contact with a vibration-detecting sensor on the fork; rotating the fork between a heating plate and a cooling plate of the annealing apparatus; outputting, by the vibration-detecting sensor, a first signal in response to a motion of the fork of the delivering robot when the wafer is loaded on the fork; and providing, by a circuitry of the annealing apparatus, a response in response to the first signal.

Annealing method

A method of controlling chemical concentration in electrolyte includes measuring the chemical concentration in the electrolyte in a tank, wherein an end of an exhaust pipe is connected to a top of the tank; determining, by a valve moved along a top surface of the tank, a vapor flux through the exhaust pipe based on the measured chemical concentration; rotating, by using a motor connected to a ball screw connected to the valve, the ball screw to move a gate of the valve based on the determined vapor flux; electroplating, using the electrolyte provided by the tank, wafers respectively in a plurality of electroplating cells that are connected to the tank; and recycling the electrolyte to the tank.

Method of controlling chemical concentration in electrolyte

A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

An annealing apparatus includes a heater plate and a cooler plate disposed in a chamber, a delivering robot, a sensor and circuitry. The delivering robot is configured to deliver a wafer between the heater plate and the cooler plate in the chamber. The sensor is located on the delivering robot and configured to output a first signal in response to a motion of the delivering robot. The circuitry is coupled to the sensor and configured to detect whether an abnormality of the delivering robot occurs according to the first signal.

Annealing apparatus and method thereof

Method of controlling chemical concentration in electrolyte and semiconductor apparatus

A method for fault detection in a fabrication tool is provided. The method includes processing a semiconductor wafer in a fabrication tool according to a plurality of process events of a process run. The method further includes measuring humidity in the fabrication tool in at least one of the process events. The method also includes comparing the humidity measured in one of the process events with an expected humidity associated with the process event. In addition, the method includes based on the comparison, indicating an alarm condition when a difference between the measured humidity and the expected humidity exceeds a range of acceptable values associated with the process event.

Growing community of inventors

Hsinchu, Taiwan

Yu-Chi Tsai