Lumileds LLC

Sunpower Corporation

Philips Lumileds Lighting Company LLC

Lumileds Lighting U.s., LLC

Koninklijke Philips Corporation N.v.

Total Marketing Services

Maxeon Solar Pte. Ltd.

Yu-Chen Shen

Michael C Johnson

Michael Ragan Krames

David D Smith

Peter John Cousins

Richard M Swanson

Tim Dennis

Marius M Bunea

Nathan Fredrick Gardner

Luke Gordon

Seung Bum Rim

Danielle Russell Chamberlin

Taiqing Qiu

Kieran Mark Tracy

Erik William Young

Gerd O Mueller

Daniel Alexander Steigerwald

David Aitan Soltz

Xiuwen Tu

Mira S Misra

Satoshi Watanabe

Peter Josef Schmidt

Daniel Bernardo Roitman

Paul Scott Martin

Kentaro Shimizu

Hisashi Masui

Stephen Andrew Stockman

James Chinmo Kim

Ashish Tandon

Tze Yang Hin

Yeow Meng Teo

Rajat Sharma

Amil Ashok Patel

Gilles Olav Tanguy Sylvain Poulain

Chee Yin Foo

Oleg Borisovich Shchekin

Toni Lopez

Marcel Rene Bohmer

Troy A Trottier

Werner K Goetz

Jonathan J Wierer, Jr

Andrei Papou

Wen Yu

Florent Monestier

Michael Joseph Ludowise

Périne Jaffrennou

Robert Woehl

Antonio Lopez Julia

Joerg Feldmann

Marinus Johannes Petrus Maria Van Gerwen

David F J Kavulak

Dennis Scott

Jeffrey DiMaria

Joseph Flemish

Mukul Agrawal

Ernest Hasselbrink, Jr

Gangyi Chen

Perine Jaffrenou

Michael R Krames

Jr Ernest Hasselbrink

A light-emitting diode (LED) die can include a p-n junction between a p-doped semiconductor material and an n-doped semiconductor material. The LED die can include vias that can electrically power the p-n junction. The vias can optionally be electrically connected in parallel to one another. A controller can supply current to the vias to electrically power the LED die. The vias can be distributed with a density that peaks at or near a center of the LED die and decreases with increasing distances away from the peak of the density, such that when the vias are electrically powered, the LED die emits light with a surface luminance that peaks at or near the center of the LED die and decreases with increasing distances away from the peak of the surface luminance.

LED die having centrally peaked surface luminance

Methods of fabricating solar cells using UV-curing of light-receiving surfaces of the solar cells, and the resulting solar cells, are described herein. In an example, a method of fabricating a solar cell includes forming a passivating dielectric layer on a light-receiving surface of a silicon substrate. The method also includes forming an anti-reflective coating (ARC) layer below the passivating dielectric layer. The method also includes exposing the ARC layer to ultra-violet (UV) radiation. The method also includes, subsequent to exposing the ARC layer to ultra-violet (UV) radiation, thermally annealing the ARC layer.

UV-curing of light receiving surfaces of solar cells

Solar cells having emitter regions composed of wide bandgap semiconductor material are described. In an example, a method includes forming, in a process tool having a controlled atmosphere, a thin dielectric layer on a surface of a semiconductor substrate of the solar cell. The semiconductor substrate has a bandgap. Without removing the semiconductor substrate from the controlled atmosphere of the process tool, a semiconductor layer is formed on the thin dielectric layer. The semiconductor layer has a bandgap at least approximately 0.2 electron Volts (eV) above the bandgap of the semiconductor substrate.

Solar cell having an emitter region with wide bandgap semiconductor material

A device may include a metal contact between a first isolation region and a second isolation region on a first surface of an epitaxial layer. The device may include a first sidewall and a second sidewall on a second surface of the epitaxial layer distal to the first isolation region and the second isolation region. The device may include a wavelength converting layer on the epitaxial layer between the first sidewall and the second sidewall.

Monolithic segmented LED array architecture with islanded epitaxial growth

Described are light emitting diode (LED) devices comprising a plurality of mesas defining pixels, each of the plurality of mesas comprising semiconductor layers, an N-contact material in a space between each of the plurality of mesas, a dielectric material which insulates sidewalls of the P-type layer and the active region from the metal. Each of the mesas is spaced so that there is a pixel pitch in a range of from 10 μm to 100 μm and dark space gap between adjacent edges of p-contact layer. The dark space gap may be less than 20% of the pixel pitch. The dark space gap may be in a range of from 4 μm to 10 μm.

Light emitting diode devices

A light emitting device and method of forming a light emitting device are disclosed. The light emitting device includes a light emitting diode and a phosphor layer formed on the light emitting diode, the phosphor layer including a plurality of phosphor particles formed in a particle layer, the particle layer including interstices between the phosphor particles, and a matrix material disposed in a portion of the interstices. A plurality of cavities may be disposed in a remaining portion of the interstices.

Ultra-thin phosphor layers partially filled with Si-based binders

A device may include a wavelength converting layer on an epitaxial layer. The wavelength converting layer may include a first surface having a width that is equal to a width of the epitaxial layer, a second surface having a width that is less than the width of the first surface, and angled sidewalls. A conformal non-emission layer may be formed on the angled sidewalls and sidewalls of the epitaxial layer, such that the second surface of the wavelength converting layer is exposed.

Monolithic segmented LED array architecture with reduced area phosphor emission surface

Described are light emitting diode (LED) devices comprising a plurality of mesas defining pixels, each of the mesas comprising semiconductor layers, an N-contact material in a space between each of the plurality of mesas, a dielectric material which insulates sidewalls of the P-type layer and the active region from the metal. A hard mask layer is above the semiconductor layers, the hard mask layer having a plurality of openings therein, each partially filled with a liner layer and partially filled with a P-metal material plug, the P-metal material plug having a width; and a passivation film is on the hard mask layer, the passivation film having a plurality of passivation film openings therein defining a width, the width of each passivation film opening being less than the width of a combination of the P-metal material plug and the liner layer.

Light emitting diode devices with defined hard mask opening

A device may include a substrate having a first embedded transistor in a first region and a second embedded transistor in a second region. The first region and the second region may be separated by trench extending through at least a portion of an epitaxial layer formed on the substrate. The first embedded transistor may be connected to a first light emitting diode (LED) and the second embedded transistor may be connected to a second LED. A first optical isolation layer may be between the epitaxial layer and the first region of the substrate. A second optical isolation layer may be between the epitaxial layer and the second region of the substrate.

Segmented LED with embedded transistors

A first component with a first sidewall and a second component with a second sidewall may be mounted onto an expandable film such that an original distance X is the distance between the first sidewall and the second sidewall. The expandable film may be expanded such that an expanded distance Y is the distance between the first sidewall and the second sidewall and expanded distance Y is greater than original distance X. A first sidewall material may be applied within at least a part of a space between the first sidewall and the second sidewall. The expandable film may be expanded such that a contracted distance Z is the distance between the first sidewall and the second sidewall, and contracted distance Z is less than expanded distance Y.

Monolithic segmented LED array architecture

A wavelength converting layer is partially diced to generate a first and second wavelength converting layer segment and to allow partial isolation between the first segment and the second segment such that the wavelength converting layer segments are connected by a connecting wavelength converting layer. The first and second wavelength converting layer segments are attached to a first and second light emitting device, respectively to create a first and second pixel. The connecting wavelength converting layer segment is removed to allow complete isolation between the first pixel and the second pixel. An optical isolation material is applied to exposed surfaces of the first and second pixel and a sacrificial portion of the wavelength converting layer segments and optical isolation material attached to the sacrificial portion is removed from a surface facing away from the first light emitting device, to expose a emitting surface of the first wavelength converting layer segment.

Monolithic LED array structure

UV-curing of light-receiving surfaces of solar cells

Growing community of inventors

Sunnyvale, CA, United States of America

Yu-Chen Shen