3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

Yu Chen

Joel Arthur Gerber

Joshua W Smith

Brian E Schreiber

Peter B Hogerton

Joshua Woodward Smith

Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with conductor thereon and an electrically conducting member or bump, protruding from the conductor, that provide a shape to one surface of the precursor circuit element. A second insulating layer, including an adhesive, is placed onto the precursor circuit element and assumes the shape of the aforementioned surface of the precursor circuit element. A portion of the insulating layer is removed proximate the apex of the bump to expose at least a portion of the bump, for a sufficient electrical connection with a subsequent circuit element, while maintaining a sufficient amount of the insulating layer on the first initiating layer and bump to facilitate the mechanical connection (bond) between this resultant circuit element and a second circuit element, that may or may not have been produced by the method of the present invention.

Circuit elements using z-axis interconnect

The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of the steps pre-applying adhesive directly to a bumped side of integrated circuit chip. The method also includes the step of pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

Methods for making z-axis electrical connections

Method for making circuit elements for a z-axis interconnect

Method for making Z-axis interconnections between adjacent circuit layers with electrically conductive traces, in multi-layered circuits, include connecting a conducting member of a deformable material to a circuit board layer and depositing an adhesive layer over an adjacent circuit board layer. The adjacent circuit layers are aligned, with the conducting member substantially collinear with the conductive traces of the adjacent circuit layers, and the circuit layers are brought together by pressure, such that the conducting member penetrates the adhesive layer and deforms until it 'cracks'. The cracking exposes fresh (unoxidized) material that contacts a conductive trace, joining the circuit layers together and creating a low resistance electrical connection. The adhesive serves to bound expansion of the deformable conducting member, reducing any potential contacts with adjacent conducting members.

Method of making a Z axis interconnect circuit

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Saint Paul, MN, United States of America

Yu Chen