Hon Hai Precision Industry Co., Ltd.

Yu-Chang Pai

Shou-Kuo Hsu

Chien-Hung Liu

Po-Chuan Hsieh

Shen-Chun Li

Wen-Laing Tseng

Hsien-Chuan Liang

Cheng-Hsien Lee

Ying-Tso Lai

Cheng-Shien Li

Hsiao-Yun Su

Jia-Chi Chen

Chun-Sheng Chen

Chun-Jen Chen

Duen-Yi Ho

Cheng-Hong Liu

Hsiao-Chuan Tu

Pei-Chun Lin

A computing device and a method for scattering parameter equivalent circuit reads a scattering parameter file from a storage device. A non-common-pole rational function of the scattering parameters in the scattering parameter file is created by applying a vector fitting algorithm to the scattering parameters. Passivity of the non-common-pole rational function is enforced if the non-common-pole rational function does not satisfy a determined passivity requirement.

Computing device and method for enforcing passivity of scattering parameter equivalent circuit

A direct current compensation method for S-parameter rational functions reads S-parameters f(sk), which are generated at given frequency sk, from a storage unit. An S-parameter, which is generated at frequency sk=0 is supplemented into the S-parameters f(sk), upon the condition that there is no S-parameter which is generated at the frequency sk=0. An S-parameter ration function is generated according to the S-parameters f(sk). A DC level of the S-parameter rational function is compensated to generate a compensated S-parameter rational function.

Direct current compensation system and method for scattering parameter rational functions

A method for modulating multiple-instruments and multiple-sensors using an electronic device. The electronic device controls an instrument to measure the working parameters of an object, and controls a sensor to detect the working temperature of the object. By comparing the working parameters against a predefined range, and comparing the working temperature against a predefined temperature value, the electronic device determines whether the instrument and the sensor need to be modulated. If any of the working parameters is not within the predefined range or if the working temperature is greater than the predefined temperature value, the electronic device controls the instrument and the sensor to be modulated by using a modulation transfer function and a predetermined direction.

Electronic device and method for controlling modulations of multiple-instruments and sensors

A simulation system for producing equivalent circuits reads data corresponding to a tabular W element format in a storage device, and adds data of the tabular W element format file using interpolation algorithm. A frequency-dependent transmission matrix is transformed into an N-port network matrix describing electrical properties of a multi-input and multi-output network. An N-port network matrix is transformed into a S-parameter matrix. A range of frequency of a s-parameter is determined and numbers of pole-residue, times for recursion and durable maximum system errors in the equivalent circuit is also determined. A vector fitting algorithm is performed and a rational function matrix composed with s-parameters is produced, to produce a general SPICE equivalent circuit based on the generated rational function matrix.

Equivalent circuit simulation system and method

An exemplary manipulator of a robot includes a fastening seat defining two guiding grooves, a driving mechanism disposed on the fastening seat, two transmitting plates respectively received in the two guiding grooves and cooperating with the driving mechanism, and two detecting bars each fixedly connecting with a corresponding transmitting plate. A detecting pin is fixed on each of the detecting bars. Under a driving action of the driving mechanism on the transmitting plates, the transmitting plates are activated to slide in the guiding grooves to cause the detecting bars to move close to or apart from each other, whereby a distance between the two detecting pins is automatically regulated.

Manipulator of robot

An exemplary antistatic device assembly includes an electricity receiving part and an electricity discharging part. Guiding portions protrude from the electricity receiving part. The electricity discharging part is located at a side of the electricity receiving part, and oriented toward and spaced from the guiding portions of the electricity receiving part. The electricity discharging part is electrically conductive and capable of being grounded. Static electricity accumulated on the electricity receiving part is removable to the electricity discharging part via the guiding portions.

Antistatic device assembly

A simulation system and method for generating equivalent circuits compatible with HSPICE reads data corresponding to N-port network system format in a storage device, and obtains S-parameter matrixes from the N-port network system. S-parameters in the S-parameter matrix that satisfy passivity are checked, and an interpolation algorithm to supplement S-parameters with passivity when some S-parameters not satisfy passivity is performed. Numbers of pole-residue, times for recursion and a tolerant system error of a rational function are generated for determining S-parameters. A rational function matrix composed of S-parameters is generated by performing a vector fitting algorithm, and an equivalent circuit is generated compatible with HSPICE format based on the generated rational function matrix.

Equivalent circuit simulation system and method for HSPICE

An enclosure of an electronic device includes a ventilation plate. The ventilation plate is a grid including a number of crisscrossed connection bars and a number of through holes defined by the connection bars. A tab is formed at each of the connection bars bounding each of the through holes. The tabs are substantially angled from a plane of the grid to elongate a path electromagnetic signals must travel to pass through the ventilation plate. The enclosure with the shields can shield the electronic device from EMI.

Enclosure of electronic device

An overdrive topology structure for transmission of a RGB signal includes a signal sending terminal, a signal receiving terminal, and a transmission line to transmit the RGB signal from the signal sending terminal to the signal receiving terminal. The transmission line is divided into a number of section transmission lines. A node is formed between every two section transmission lines. An impedance of a first section transmission line approaching to the signal sending terminal is less than an impedance of a second section transmission line approaching to the first section transmission line to overdrive the RGB signal at a first node between the first and second section transmission lines. At least one node except the first node is grounded via a resistor. An equivalent resistance of the resistor is equal to a resistance of the first resistor.

Overdrive topology structure for transmission of RGB Signal

A signal transmission apparatus includes two circuit layers. First and second ground sheets each has a rectangular area are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the two rectangular areas on a surface where the third ground sheet in only have one common border with the third ground sheet. The third ground sheet is formed by extending the common border along a signal transmission direction. The differential pair includes a number of section pairs each composed of two sections arranged in the two transmission lines symmetrically. Every two adjacent section pairs are equivalent to a capacitor and an inductor.

Signal transmission apparatus

A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole extends through the printed circuit board. A thermal engraving is defined in the surface of the layer, surrounding the through hole and without being covered by the layer of copper. The thermal engraving includes a first opening and a second opening. The first opening of the thermal engraving faces an output terminal of the power supply, and is non-contiguous with the second opening.

Printed circuit board

An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.

A signal transmission apparatus includes two circuit layers. First and second ground sheets are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the first and second ground sheets on the third ground sheet superpose a border of the third ground sheet. The third ground sheet is formed by extending the border along a signal transmission direction. A vertical distance between the first and second transmission lines is twice as each of a vertical distance from the first ground sheet to the first transmission line and a vertical distance from the second ground sheet to the second transmission line.

An enclosure of an electronic device includes a plate. The plate defines a number of through holes. Each through hole has a pair of tabs connected to each other and with the through hole. Each pair of tabs are slantingly bent towards an inside of the enclosure. The enclosure with the shields can shield the electronic device from electro-magnetic interference.

A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. An approximately C-shaped thermal engraving is defined in the surface of the layers, surrounding the through hole and without being covered by the layer of copper. An opening of the thermal engraving faces an output terminal of the power supply.

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Taipei Hsien, Taiwan

Yu-Chang Pai