Sharp Kabushiki Kaisha Corporation

Sakai Display Products Corporation

Hon Hai Precision Industry Co., Ltd.

Sharp Corporation

Yozo Narutaki

Takayuki Shimada

Masumi Kubo

Yutaka Ishii

Mikio Katayama

Katsuhiko Kishimoto

Shogo Fujioka

Youji Yoshimura

Atsushi Ban

Yuko Maruyama

Kiyoshi Minoura

Shinya Yamakawa

Hiroshi Tsuchiya

Shinji Shimada

Yuhki Kobayashi

Kohzoh Nakamura

Masahiro Mitani

Kohichi Fujimori

Shinichi Kawato

Hisashi Nagata

Kazuyoshi Fujioka

Koichi Fujimori

Kazushige Miyamoto

Hirohiko Nishiki

Tokihiko Shinomiya

Yasunobu Akebi

Ikuji Konishi

Yoji Yoshimura

Yoshitaka Yamamoto

Shuichi Kozaki

Kohichi Tanaka

Yukiko Ichimura

Yoshihiro Izumi

Hisashi Watanabe

Kazutaka Hanaoka

Masaru Yoshida

Akihiro Yamamoto

Hiroyuki Moriwaki

Akiyoshi Fujii

Naofumi Kimura

Sayuri Fujiwara

Yoshinori Shimada

Akihito Jinda

Masataka Matsuura

Akitsugu Hatano

Kazuhiro Maekawa

Hisakazu Nakamura

Kenichi Nakagawa

Ryuichi Kijima

Shirrya Yamakawa

An organic EL device has a substrate, a drive circuit layer, a first inorganic protective layer, an organic planarizing layer, an organic EL element layer, and a TFE structure including a first inorganic barrier layer. When viewed from a normal line of the substrate, the organic planarizing layer is formed within a region where the first inorganic protective layer is formed, while an organic EL element is disposed within a region where the organic planarizing layer is formed. In a portion where the first inorganic protective layer and the first inorganic barrier layer are in direct contact with each other on a lead-out line of the drive circuit layer, the first inorganic barrier layer includes, in a cross-section parallel to a line width direction of the lead-out line, a lateral face having a taper angle of less than 90°.

Organic electroluminescent device including thin film encapsulation structure and method for producing same

This organic EL device () has a substrate (), a drive circuit layer (), a first inorganic protective layer (Pa), an organic planarizing layer (Pb), an organic EL element layer (), and a TFE structure (). The TFE structure has a first inorganic barrier layer (), an organic barrier layer (), and a second inorganic barrier layer (). When viewed from a normal line of the substrate, the organic planarizing layer is formed within a region where the first inorganic protective layer is formed, while an organic EL element is disposed within a region where the organic planarizing layer is formed. The TFE structure has an exterior edge which intersects with a lead-out line () and which is situated between an exterior edge of the organic planarizing layer and an exterior edge of the first inorganic protective layer. In a portion where the first inorganic protective layer and the first inorganic barrier layer are in direct contact with each other on the lead-out line, the first inorganic barrier layer has, in a cross-section parallel to the line width direction of the lead-out line, a lateral face that is configured to have a taper angle θ () of less than 90°. The organic planarizing layer has a surface that is not more than 50 nm in arithmetic average roughness Ra.

Organic electroluminescent device and method for producing same

This organic EL device () has a substrate (), a drive circuit layer (), a first inorganic protective layer (Pa), an organic planarizing layer (Pb), an organic EL element layer (), a second inorganic protective layer (Pa), and a TFE structure (). The TFE structure has a first inorganic barrier layer (), an organic barrier layer (), and a second inorganic barrier layer (). When viewed from a normal line of the substrate, the organic planarizing layer is formed within a region where the first inorganic protective layer is formed, while an organic EL element is disposed within a region where the organic planarizing layer is formed. The TFE structure has an exterior edge which intersects with a lead-out line () and which is situated between an exterior edge of the organic planarizing layer and an exterior edge of the first inorganic protective layer. In a portion where the first inorganic protective layer and the first inorganic barrier layer are in direct contact with each other on the lead-out line, the first inorganic barrier layer has, in a cross-section parallel to the line width direction of the lead-out line, a lateral face that is configured to have a taper angle &#x3b8; () of less than 90&#xb0;. The organic planarizing layer has a surface which exceeds 50 nm in arithmetic average roughness Ra, while the second inorganic protective layer has a surface that is not more than 50 nm in arithmetic average roughness Ra.

An organic EL device (D) according to an embodiment of the present invention has: a substrate (); a drive circuit layer () having a plurality of TFTs formed on the substrate; interlayer insulation layers (Pa,Pb) formed on the drive circuit layer; an organic EL element layer () formed on the interlayer insulation layers; and a thin-film sealing structure (DE) formed so as to cover the organic EL element layer. The interlayer insulation layers have contact holes (CH, CH). Contact parts (C, C) that connect the drive circuit layer and the organic EL element layer are formed inside the contact holes. The surface (Pb_Sb) of the interlayer insulation layers and the surface (C_Sb) of the contact parts are flush, and the arithmetic average roughness Ra of the surfaces are 50 nm or less.

Organic electroluminescent device with organic flattening layer having surface Ra of 50 nm or less and method for producing same

According to an embodiment of the invention, the organic EL device () comprises: an element substrate () having a substrate () and a plurality of organic EL elements () supported by the substrate; a thin film encapsulation structure () formed above the plurality of organic EL elements and having at least one compound layered body (S) constituted by a first inorganic barrier layer (), an organic barrier layer () in contact with the upper surface of the first inorganic barrier layer and having a plurality of solid sections spread out discretely, and a second inorganic barrier layer () in contact with the upper surface of the first inorganic barrier layer and the upper surfaces of the plurality of solid sections of the organic barrier layer; an organic planarization layer () provided above the thin film encapsulation structure and formed from a photosensitive resin; and a touch sensor layer () disposed above the organic planarization layer.

Organic electroluminescent display device and method for producing same

In the present embodiment, a sealing agent () sealing two substates contains a low melting-point glass material and is adhered to each of a first substrate () and a second substrate (), a barrier rib (), which is formed in such a manner as to surround the outer periphery of an electronic element (), is disposed between the sealing agent () and the electronic element (), and between the first substrate () and the second substrate (), and the sealing agent () is spaced apart from the barrier rib (). As a result, a deterioration of the electronic element, caused by the heat produced when sealing, may be prevented while the electronic element formed between the two substrates is protected from moisture and oxygen.

Substrate sealing structure body, and, display device and production method therefor

The present invention has: a reflective liquid crystal display element () that is formed in a first region (R) on a TFT substrate () and having at least the upper surface thereof comprising an inorganic insulating film (), and that has a reflective electrode (), a liquid crystal layer (), and a counter electrode (); and a light-emitting element () that is formed in a second region (T) above the insulating layer of the TFT substrate, and that has a first electrode (), a light-emitting layer (), and a second electrode (). In addition, the light-emitting element has an encapsulating layer () formed of an inorganic insulating layer that covers the entirety of each light-emitting region, and an end portion of the encapsulating layer is bonded to the inorganic insulating film of the insulating layer.

Display device

An organic EL device (D) according to an embodiment of the present invention has: a substrate (); a drive circuit layer () having a plurality or TFTs formed on the substrate; interlayer insulation layers (Pa,Pb) formed on the drive circuit layer; an organic EL element layer () formed on the interlayer insulation layers; and a thin-film sealing structure (DE) formed so as to cover the organic EL element layer. The interlayer insulation layers have contact holes (CH, CH). Contact parts (C, C) that connect the drive circuit layer and the organic EL element layer are formed inside the contact holes. The surface (Pb_Sb) of the interlayer insulation layers and the surface (C_Sb) of the contact parts are flush, and the arithmetic average roughness Ra of the surfaces are 50 nm or less.

A display device according to one embodiment of the present invention is provided with a plurality of pixels which are arranged as a matrix on a substrate, and each of which is provided with a liquid crystal display element and an organic EL display element. The organic EL display element is provided with a positive electrode and a negative electrode, which are formed so as to be electrically separated from a pixel electrode and a counter electrode of the liquid crystal display element. Each one of the plurality of pixels is provided with: a first transistor which changes the magnitude of a current to be supplied to the organic EL display element on the basis of the potential of a first bus line; a second transistor which electrically separates the first bus line and the pixel electrode from each other on the basis of the potential of a third bus line; and a third transistor which electrically connects the first transistor and the second transistor with the first bus line on the basis of the potential of a second bus line. A method for driving a display device according to one embodiment of the present invention reduces the potential difference between the pixel electrode and the counter electrode before turning off the second transistor during switching from display by means of the liquid crystal display element to display by means of the organic EL display element.

Display device and method for driving display device

A display device includes a first substrate including a light-emitting element that is an upward light emission type and a transistor in a lower layer than the light-emitting element, a second substrate facing the first substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a sealing film formed in an island shape and covering the light-emitting element and a pixel electrode that is transparent. The pixel electrode includes a first portion not overlapping the sealing film and a second portion overlapping the sealing film.

A reflective liquid crystal display device () including a reflection electrode (), a liquid crystal layer (), and a counter electrode () is formed above an insulating layer () in a first region (R) of a TFT substrate (). An organic EL display device () including a first electrode (), an organic layer (), and a second electrode () is formed on the insulating layer () of the TFT substrate () in a second region (T). A coating layer () is formed at least on a surface of the organic EL display device () so as to wrap the second electrode () and the organic layer () of the organic EL display device (). A part of the coating layer () is in contact with the insulating layer (). As a result, a complex display apparatus capable of preventing the organic layer from deteriorating and excellent in reliability can be obtained.

Display apparatus

A display device includes a first substrate including a light-emitting element that is an upward light emission type and a transistor in a lower layer than the light-emitting element, a second substrate facing the first substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a sealing film formed in an island shape and covering the light-emitting element, a pixel electrode including a first portion not overlapping the sealing film, and a light reflective film overlapping the first portion and including a recessed and protruded surface.

An organic electroluminescent device includes a substrate, driving circuit layer, inorganic protective layer, organic flattening layer, organic electroluminescent element layer, and TFE structure. The TFE structure includes a first inorganic barrier layer, organic barrier layer, and second inorganic barrier layer. The organic flattening layer is formed in a region where the inorganic protective layer is formed, organic electroluminescent elements are located in a region where the organic flattening layer is formed, and an outer perimeter of the TFE structure crosses lead wires and is present between an outer perimeter of the organic flattening layer and an outer perimeter of the inorganic protective layer. In a region where the inorganic protective layer and the first inorganic barrier layer are in direct contact with each other on the lead wires, a tapering angle of a side surface of a cross-section of the first inorganic barrier layer is smaller than 90 degrees.

Multilayer thin film encapsulation structure for an organic electroluminescent device

Growing community of inventors

Yamatokoriyama, Japan

Yozo Narutaki