Intel Corporation

Youzhi E Xu

Fay Hua

Carl L Deppisch

Linda A Shekhawat

Gregory S Constable

Joni G Hansen

Nisha Anathakrishan

Nisha Ananthakrishan

An underfill formulation includes a solvent (), a plurality of amphiphilic block copolymers () in the solvent, and an adhesion promoter () in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles () in the solvent, with the micelles including a core () and a shell () surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.

Underfill formulation and method of increasing an adhesion property of same

A composite of two or more thermal interface materials ('TIMs') is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Electronic assemblies with hot spot cooling and methods relating thereto

Electronic assembly with hot spot cooling

A thermal interface material may be covalently bonded to a bottom surface of a heat dissipating device and/or a backside surface of a heat generating device. The heat dissipating device may be thermally coupled to the heat generating device, the thermal interface material disposed between the bottom surface of the heat dissipating device and the backside surface of the heat generating device. The thermal interface material may comprise a polymer material with thermally conductive filler components dispersed therein. For one embodiment, the thermally conductive filler components may be covalently bonded together. For one embodiment, the thermally conductive filler components may be covalently bonded with the polymer material.

Heat transfer through covalent bonding of thermal interface material

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Gilbert, AZ, United States of America

Youzhi E Xu