Taiyo Yuden Co., Ltd.

Taiyo Yudenco., Ltd.

Yousuke Nakada

Kazuya Sato

Tetsuo Shimura

Masaki Mochigi

Kenji Matsumoto

Shinichi Tsunoda

Yasuyuki Mashimo

Yasuyuki Inomata

A ceramic capacitor includes a multilayer structure, wherein a main component of dielectric layers is ceramic expressed by a general formula ABO(0.995&#x2264;m&#x2264;1.010), wherein the dielectric layers include a rare earth element Re as a first sub-component by 2.0 mol to 5.0 mol when converted into ReO/2, include Mg as a second sub-component by 1.0 mol to 3.0 mol when converted into MgO, include V as a third sub-component by 0.05 mol to 0.25 mol when converted into VO/2, include Si as a fourth sub-component by 0.5 mol to 5.0 mol when converted into SiO, include an alkali earth metal element M as a fifth sub-component by 0.1 mol to 5.0 mol when converted into MCO, on a presumption that an amount of the ceramic is 100 mol, wherein a ratio Si/V is 30 or less.

Ceramic capacitor, circuit substrate and manufacturing method of ceramic capacitor

A ceramic electronic component includes a ceramic body, a sintered metal film, and a metal terminal. The ceramic body includes internal electrodes. The sintered metal film has a joint surface having a surface roughness Ra of 0.200 &#x3bc;m or less. The sintered metal film is connected to the internal electrodes and formed on a surface of the ceramic body. The metal terminal is jointed to the joint surface.

Ceramic electronic component, method of producing the same, and electronic component mounting substrate

A multilayer ceramic capacitor includes: a multilayer structure in which internal electrodes and dielectric layers are alternately stacked; a first external electrode connected to a subset of the internal electrodes; and a second external electrode sandwiching the multilayer structure with the first external electrode in a first direction is connected to another subset of the internal electrodes, wherein t&#xd7;W/N is equal to or more than 0.1, when a distance between a first edge positioned at outermost of the internal electrodes in a second direction intersecting with the first direction in a plane direction of the internal electrodes and the dielectric layers and a second edge positioned at innermost of the internal electrodes in the second direction is W(mm), each thickness of the plurality of dielectric layers is t(&#x3bc;m), and a stack number of the plurality of dielectric layers is N.

Multilayer ceramic capacitor with internal electrodes having different edge positions

A multilayer ceramic capacitor includes: a multilayer structure having an internal electrode and a dielectric layer alternately stacked; external electrodes provided on a first and second faces of the multilayer structure, wherein t&#xd7;L/N is equal to or more than 0.1, when a distance between a first edge positioned at outermost of edges of the plurality of internal electrodes that are not connected to the first external electrode or the second external electrode in an array direction of the first external electrode and the second external electrode and a second edge positioned at innermost of edges of the plurality of internal electrodes that are not connected to the first external electrode or the second external electrode in the array direction is L(mm), each thickness of the plurality of dielectric layers is t(&#x3bc;m), and a stack number of the plurality of dielectric layers is N.

Multilayer ceramic capacitor

In an embodiment, an electronic component fuseincludes: (1) an insulator sleevehaving a hollow partthat opens to the exterior at both ends; (2) a conductor elementhaving a fusible partwhose cross-section is smaller than the cross-section of the hollow part, a first engagement partprovided at one end of the fusible part, and a second engagement partprovided at the other end of the fusible part, where the fusible partis positioned in the hollow part, the first engagement partand the second engagement partare disposed on the respective ends of the insulator sleeve; (3) a first terminalhaving a first connection partconnected to the first engagement part; and (4) a second terminalhaving a second connection partconnected to the second engagement part

Electronic component fuse and fused electronic component module

An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.

Growing community of inventors

Takasaki, Japan

Yousuke Nakada