Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Yousuke N Irie

Hiroshi Sakakima

Mitsuo Satomi

Yasuhiro Kawawake

Hirotsugu Inoue

Kazuo Yokoyama

Ryoji Hirose

Takuya Niioka

Masaaki Suzuki

Hideki Kuwajima

Satoru Fujii

Masahiko Hashimoto

Kiyoyuki Morita

Shinichi Yamamoto

Kaoru Matsuoka

Akihisa Adachi

Takeshi Uenoyama

Isaku Kanno

Kenichi Sakamoto

Yu Kurokawa

Koutaro Sakamoto

Michiyasu Hirota

Ryougo Kawai

Shogo Tokunaga

A stress analysis device for moving body, includes: an infrared camera that captures an infrared image of a moving body while making a relative movement with respect to the moving body; and an image processing unit that performs image processing on a plurality of the infrared images captured by the infrared camera. The image processing unit includes: an alignment unit that aligns portions of an object included in the moving body in the plurality of the infrared images including the object, and a stress distribution calculation unit that calculates temperature changes of each of the portions of the object to obtain stress distributions of the portions of the object based on the temperature changes.

Stress analysis device for moving body

A stress analysis device includes: an imaging element that obtains temperature images over a same time range for a same region of an object; a feature point extractor that extracts a feature point in each of the temperature images; a projection transformer that performs projective transformation on each of the temperature images to align the feature point in the temperature images, and aligns the temperature images with respect to a temperature image being a reference; a pixel rearranger that rearranges a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference; a stress converter that obtains a stress image by multiplying each of the temperature images after pixel rearrangement by a stress conversion coefficient; and an additional averaging part that obtains an additional averaging stress image by adding and averaging the stress images.

Stress analysis device

A stress properties measurement method for measuring properties of stresses generated in a structure includes acquiring, from a first imaging device, a plurality of thermal images corresponding to temperatures of a surface of the structure, the plurality of thermal images being different in imaging time from each other, generating a stress distribution image corresponding to each of the plurality of thermal images, acquiring a stress value of a first section that is smaller in stress gradient than a predetermined value and respective stress values of a plurality of second sections where stresses are concentrated for the stress distribution images, and deriving correlation properties of stresses at a section of the structure based on the stress value of the first section acquired and the respective stress values of the plurality of second sections acquired.

Stress properties measurement method, device, and system correlated based on stress gradients on multiple regions

A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.

Thickness measurement method, thickness measurement device, defect detection method, and defect detection device

A method is disclosed for measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first data by sensing, through a first sensing unit, of a moving object or an identification display object attached to the structural object; calculating, based on the first data, a movement duration in which the moving object moves between the support parts; generating, as second data, thermal data by sensing of a surface of the beam part through a second sensing unit; calculating a temperature change amount based on a second data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.

Stress distribution measurement method and stress distribution measurement system

A stress distribution image processing device including:

Stress distribution image processing device

A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.

Stress measurement device, stress measurement system, and stress measurement method

In a stress measurement method, an object to be measured is vibrated at a plurality of oscillation frequencies, and a temperature amplitude of the object to be measured is measured by using a temperature sensor. Parameters of a one-dimensional heat conduction equation described below are identified by performing curve-fitting, on the basis of the one-dimensional heat conduction equation, on a measurement value of the temperature amplitude with respect to frequency characteristics of a temperature change component and a phase component based on a thermoelastic effect. The frequency characteristics are obtained at the plurality of oscillation frequencies. The one-dimensional heat conduction equation indicates a theoretical solution of a temperature amplitude on a surface of a coating film based on heat conduction and the thermoelastic effect of each of a substrate and the coating film. Then, a stress of the object to be measured is obtained based on the identified parameters.

Stress measurement method, stress measurement device, and stress measurement system

A fatigue limit stress specification system includes: a vibration generator that repeatedly applies a load to an object to be measured; a temperature sensor that measures a change in temperature of the object to be measured; and an information processing device that measures a fatigue limit stress of the object to be measured. The information processing device obtains a relation between a temperature amplitude of a fundamental frequency component of vibration for the object to be measured and a temperature amplitude of a second harmonic component of the vibration, performs fitting on the relation by using a first approximate line and a second approximate line, the first approximate line including a quadratic curve, the second approximate line including a quadratic curve, and obtains the fatigue limit stress of the object to be measured based on an intersection of the first approximate line and the second approximate line.

Fatigue limit stress specification system, fatigue limit stress specification device, and fatigue limit stress specification method

Method for measuring a depth of a defect inside an inspection object is provided. The method comprises steps of: generating thermal image data corresponding to a temperature of a surface of the inspection object by photographing a heated surface of the inspection object at a predetermined time interval by a photographing device; obtaining a temperature curve showing a temporal change in temperature of the surface of the inspection object based on the thermal image data; fitting a theoretical equation obtained from a heat conduction equation including a parameter related to the depth of the defect of the inspection object to the temperature curve to obtain a theoretical curve showing a temporal change in temperature of the surface of the inspection object; and obtaining the depth of the defect of the inspection object based on a value of the parameter in the theoretical equation corresponding to the theoretical curve.

A stress distribution measurement method is a method of measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first image data by performing, through a first image capturing unit, image capturing of a moving object or an identification display object attached to the structural object from the moving object; calculating, based on the first image data, a movement duration in which the moving object moves between the support parts; generating, as second image data, thermal image data by performing image capturing of the surface of the beam part through a second image capturing unit; calculating a temperature change amount based on a second image data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.

A cleaning effect is improved by cleaning a component that has a recess structure by using a cleaning medium of a liquefied gas or a supercritical fluid. By the cleaning method of removing adhering substances adhering to at least the surface of the recess structure of the component that has the recess structure, cleaning is carried out by using the supercritical gas or the liquefied gas so that the cleaning medium spreads over the surface of the recess structure.

Cleaning method and cleaning apparatus

A head support mechanism includes a head and a slider for carrying the head, the head being caused to track by main driver, wherein the head support mechanism further includes sub-driving device including a thin film and causing the head to have a micro-movement; and the sub-driving device causes the head to have a micro-movement by utilizing flexural deformation of the thin film.

Head support mechanism, information recording/reproducing apparatus, and method of manufacturing head support mechanism

A piezoelectric element includes: a piezoelectric film made of PZT; a pair of electrodes (a lower electrode and an upper electrode) arranged with the piezoelectric film being interposed therebetween; and a base film made of PLT having a thickness of about 50 nm to 200 nm and provided between the piezoelectric film and the lower electrode. The piezoelectric element, as a whole, is provided on a substrate, which may be a stainless steel substrate (polycrystalline), a heat-resistant glass substrate (amorphous), a silicon substrate (single crystal), etc. A piezoelectric element having a good piezoelectric characteristic can be provided on a substrate other than a single crystal substrate.

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Kadoma, Japan

Yousuke N Irie