Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Yousuke Hisakuni

Nobuhiro Yamamoto

Kota Tokuda

Kazuo Watabe

Takashi Usui

Kenji Hirohata

Hidefumi Takamine

Yuki Ueda

Keisuke Ueno

Hiroshi Ota

Junichiro Ooga

Ryoji Ninomiya

Takahiro Omori

Takuya Hongo

Kiyokazu Ishizaki

Hirofumi Omote

According to one embodiment, a structure evaluation system includes at least three or more sensors, a position locator, and an evaluator. The three or more sensors are arranged on surfaces different from a surface to which an impact is applied with respect to a structure at different intervals in a first direction of the structure and a second direction orthogonal to the first direction and detects elastic waves generated from the structure. The position locator locates a position of a source in which the elastic waves are generated on the basis of the elastic waves detected by each of the three or more sensors. The evaluator evaluates a deterioration state of the structure on the basis of information based on a position location process of the position locator and information indicating a position where the impact is applied.

Structure evaluation system, structure evaluation apparatus, and structure evaluation method

According to one embodiment, a structure evaluation system includes an impact imparting unit, a plurality of sensors, a position locator, and an evaluator. The impact imparting unit applies impacts to a second region different from a first region of a structure to which traveling sections of a vehicle, which travels on the structure, apply impacts. The plurality of sensors detect elastic waves generated in the structure. The position locator locates a position of a source of the elastic waves on the basis of the elastic waves detected by each of the plurality of sensors. The evaluator evaluates a deterioration state of the structure on the basis of a position location result of the position locator.

Structure evaluation system and structure evaluation method

According to one embodiment, a wiring board unit includes a reinforcing board, a flexible printed circuit board includes a joint portion including a first plane and a second plane and attached on the reinforcing board, a relay unit extending from the first plane, a plurality of connection pad groups located on one of the first plane and the second plane and a first IC chip mounted on the first plane, and the joint portion is bent on a boundary between the first plane and the second plane.

Wiring board unit for disk devices, actuator assembly for disk devices and disk device comprising the same

According to one embodiment, a vibration detecting device includes a housing, a vibration sensor in the housing, a circuit board in the housing, a flexible wiring component, a first face, and a second face. The vibration sensor is housed in the housing. An electric component that processes a detection signal of the vibration sensor is provided on the circuit board. The wiring component electrically connects the vibration sensor and the circuit board. The first face is provided on the housing and is configured to be attached to an object. The second face is provided inside the housing and is inclined with respect to the first face, the vibration sensor being attached thereto.

Vibration detecting arrangement for reducing resonant noise

According to one embodiment, an electronic device includes a housing with a through-hole, a flexible printed circuit inserted through the through hole and including a first connection portion on an inner side of the housing with first connection pads and a second connection portion on an outer side of the housing with second connection pads, a first electrical component in the housing, and a first connector connected to the first electrical component and including connection terminals contacting the first connection pads. A first pad of the first connection pads is greater than other first connection pads.

Electronic device with housing storing electronic component

According to one embodiment, a magnetic disk device includes a housing having a box-shaped base with a bottom wall, a first connection portion provided inside the bottom wall, a second connection portion provided outside the bottom wall and electrically connected to the first connection portion, a control circuit board provided outside the housing, a third connection portion fixed to an inner surface of the control circuit board facing the bottom wall, and abutting on and electrically connecting to the second connection portion, and a reinforcement member positioned between the control circuit board and the bottom wall and provided around the third connection portion.

Magnetic disk device

According to one embodiment, an actuator assembly includes a head actuator including an actuator block having a first surface, a second surface intersecting the first surface, and a first groove provided on the second surface, and a suspension assembly supporting a magnetic head and a wiring board including a plate arranged on the first surface, a flexible printed circuit board provided on the plate, and an IC chip provided on the flexible printed circuit board, wherein the plate comprises a first engaging portion engaging with the first groove.

Actuator assembly of disk device and disk device comprising the same

According to one embodiment, an apparatus for loading vibration is provided. The apparatus for loading vibration has a contacting unit, a first vibration unit, a storage unit and a control unit. The contacting unit is capable of coming into contact with a biological body which pulsates or beats in a contact state of a first contact condition. The first vibration unit provides a self-excited vibration to the biological body through the contacting unit. The storage unit stores a second contact condition which synchronizes the self-excited vibration with the pulses or the beats. The control unit controls the contact state of the contacting unit so as to make the first contact condition become closer to the second contact condition.

Apparatus for loading vibration

According to one embodiment, an electronic apparatus includes, for example, a casing having an opening with a perimeter, and a circuit board including a first surface facing away from the casing and a second surface facing the casing, a first conductor which extends over the opening in the casing and at least a portion of which is located over the first surface, a second conductor at least portion of which extends over the second surface and is exposed to the interior of the casing at the opening in the casing, and a third conductor extending through the first surface and the second surface and electrically connected to the first conductor and the second conductor at a location outward of the perimeter of the opening.

Electronic apparatus

According to one embodiment, an electronic device includes a flexible printed-wiring board which includes a first face and a second face, and is supported by the support member. One or more electronic components are mounted on the first face. The electronic device is fixed onto the second face. The flexible printed-wiring board includes a plurality of first regions, on which the one or more electronic components are mounted or to which a member secured on the support member is fixed. When viewed from a direction orthogonal to the first face, the plate is provided with an opening between two first regions of the plurality of first regions.

Electronic device

A semiconductor device includes a housing, a substrate housed in and fixed to the housing, and a semiconductor module package disposed on a surface of the substrate. A protrusion is formed on the housing, protrudes towards the substrate, located adjacent to the semiconductor module package, and directly or indirectly urges the substrate in a direction away from the protrusion.

Semiconductor device having a substrate restrained from thermal deformation

According to one embodiment, a first joint unit and a second joint unit are disposed with space on a heat radiation substrate. A joint area of the second joint unit is larger than that of the first joint unit. An insulated substrate is disposed on the first joint unit and the second joint unit. A corner region of the insulated substrate contacts the first joint unit. A first sensor to measure an acceleration of vibration applied to the insulated substrate is disposed thereon. The first sensor is more adjacent to the first joint unit than the second joint unit. A response spectrum of the acceleration is calculated. An extension status of joint failure of the first joint unit is decided by comparing a frequency of a maximum peak of the response spectrum with a reference frequency. A break of the second joint unit is estimated based on the extension status

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Sagamihara Kanagawa, Japan

Yousuke Hisakuni