Dic Corporation

Yousuke Hirota

Yutaka Satou

Shota Tanii

Norio Nagae

Koji Hayashi

Kunihiro Morinaga

Ichirou Ogura

Yoshiyuki Takahashi

Nobuya Nakamura

Takamitsu Nakamura

Provided are an epoxy resin including: an epoxidized product of monoalkyl dihydroxybenzene; and a compound that is detected in the molecular weight range from a molecular weight at the peak top of the epoxidized product of the monoalkyl dihydroxybenzene to the molecular weight at the peak top+20 to 40 and has a peak area % of 0.1% to 0.8% in a GPC chart, and an epoxy resin including an epoxidized product of monoalkyl catechol in which the ratio of the total content of a cyclic compound having a cyclic structure that has two adjacent oxygen atoms derived from the monoalkyl catechol as constituent atoms and a monoglycidyletherified product of the monoalkyl catechol to the content of a diglycidyletherified product of the monoalkyl catechol is in the range of 0.10 to 0.40 as measured by high performance liquid chromatography.

Epoxy resin, production method, epoxy resin composition and cured product of same

A phenol novolak resin having an excellent balance between the mold shrinkage of a composition containing the phenol novolak resin during heat curing and the modulus of elasticity at high temperature. A phenol novolak resin that is an alkyl phenol novolak resin produced by bonding alkyl phenol (I), in which an alkyl group having a carbon number of 4 to 8 is included as a substituent on an aromatic ring, to each other with a methylene group interposed therebetween, wherein the ratio (a)/(b) of a value (a) of integration from 146 to 148 ppm to a value (b) of integration from 146 to 153 ppm based on the 13C-NMR measurement is within the range of 0.05 to 0.30, and the area ratio of alkyl phenol (I) based on GPC measurement is within the range of 0.01% to 3.0%, a curable resin composition using the same, and a cured product thereof.

Phenol novolak resin, curable resin composition, and cured product thereof

An epoxy resin exhibits a small change in volume after thermal history, is excellent in low thermal expansion and low moisture absorption, and has high heat resistance, in terms of a cured product obtained therefrom; a curable resin composition; a cured product which has all the above properties; a semiconductor encapsulating material; a semiconductor device; a prepreg; a circuit board; a buildup film; a buildup substrate; a fiber-reinforced composite material; and a molded article. The present invention is characterized by an epoxy resin, characterized by including as essential components, a cresol-naphthol co-condensed novolac type epoxy resin (A), a naphthol glycidyl ether compound (B), and one or more xanthene compounds (C) selected from the group of compounds represented by the following structural formulae (1) to (3), wherein the content of the xanthene compound(s) (C) is from 0.1% to 5.5% in terms of area ratio in a GPC measurement. 

Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article

Provided are a phenolic-hydroxyl containing resin, an epoxy resin, and a curable resin composition containing either resin that have high flowability and exhibit high heat resistance and flame retardancy after curing, a cured composition formed therefrom, and a sealant. A phenolic-hydroxyl containing resin is prepared by reacting a polycondensate of a phenolic compound (a) and formaldehyde with an aralkylating agent. The phenolic-hydroxyl containing resin contains as essential components a monoaralkylated derivative (x1) of the phenolic compound (a) having one aralkyl group on an aromatic nucleus thereof and a diaralkylated derivative (x2) of the phenolic compound (a) having two aralkyl groups on an aromatic nucleus thereof. An epoxy resin is prepared by converting the phenolic-hydroxyl containing resin into a polyglycidyl ether.

Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealant

A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

Growing community of inventors

Ichihara, Japan

Yousuke Hirota