Henkel IP Holding Gmbh

Henkel Ag & Company, Kgaa

Younsang Kim

Jie Bai

Tadashi Takano

Hong Jiang

Yusuke Horiguchi

Hung Chau

Ly Do

Qiaohong Huang

Julissa Eckenrode

Youko Murata

Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for the preparation of a variety of electronic devices, such as flip chip packages, stacked dies, hybrid memory cubes, through-silica via (TSV) devices, and the like. In certain embodiments of the invention, there are provided assemblies comprising a first article permanently adhered to a second article by a cured aliquot of a formulation as described herein. In certain embodiments of the invention, there are provided methods for adhesively attaching a first article to a second article. In certain embodiments of the present invention, there are provided methods for improving heat dissipation by electronic devices assembled employing thermally conductive, but electrically non-conductive adhesive.

Thermally conductive pre-applied underfill formulations and uses thereof

Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages

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Foothill Ranch, CA, United States of America

Younsang Kim