Other

Avago Technologies Wireless IP (singapore) Pte. Ltd.

Avago Technologies General IP (singapore) Pte. Ltd.

Solid, Inc.

Avago Technologies Korea Co. Ltd.

Wavics, Inc.

Samsung Electronics Co., Ltd.

Caldera Micro Technology, Inc.

Youngwoo Kwon

Junghyun Kim

Daehee Lee

Sanghwa Jung

Moon-Seok Jeon

Ki Woong Chung

Seong-Jun Bae

Hoon Song

Jungwoo Kim

Jung-Hyun Kim

John H Hong

Won Yup Ko

Insang Song

Moon-Suk Jeon

Kyushik Hong

Cimoo Song

Changyul Cheon

Yong-Gyo Seo

Seokjin Kang

Jinho Jeong

John Hyunchul Hong

Nyuntae Kim

Provided are an optical relay system and a method for setting identification information of a remote device in an optical relay system. In particular, provided are an optical relay system and a method for setting identification information of a remote device in an optical relay system in which a donor device generates unique identification information of a remote device based on temporary identification information and characteristic information received from the remote device to automatically set identification information of the remote device, and as a result, the optical relay system can be normally implemented rapidly in initial installation of the optical relay system or a change of an optical relay system environment and convenience of a manager and reliability of a mobile communication service can be improved.

Optical relay system and method for setting identification information of remote device in optical relay system

An integrated circuit module package includes a lead frame having a recessed area. A semiconductor die containing active electrical components is attached to the recessed area of the lead frame. An integrated passive device containing passive electrical components is vertically stacked with, and electrically coupled to, the semiconductor die. An optional heat sink is attached to the integrated passive device. The integrated passive device is connected to the lead frame by conductors to electrically couple the integrated passive device and the semiconductor die to circuitry external to the integrated circuit module package. A cap is then attached to the heat sink or the integrated passive device to protect the semiconductor die and the integrated passive device. The integrated circuit module package dissipates heat from the semiconductor die through the lead frame, and dissipates heat from the integrated passive device through the cap and optional heat sink.

Integrated circuit module package and assembly method thereof

A low profile radio frequency (RF) module and package with efficient heat dissipation characteristics, and a method of assembly thereof, are provided. In some embodiments, the RF module package comprises a radio frequency integrated circuit (RFIC) attached to a recessed area of a lead frame. The RFIC has an active integrated circuit pattern and a plurality of conductors formed on input/output pads of the active integrated circuit pattern. An integrated passive device (IPD) is attached to the RFIC via the plurality of conductors. The IPD has a passive integrated circuit pattern, a plurality of electrode pads connected to nodes of the passive integrated circuit pattern, and metal-filled vias for electrically connecting the electrode pads to the plurality of conductors. The RFIC includes a plurality of heat conducting vias for conducting heat to the lead frame.

Multilayer integrated circuit for RF communication and method for assembly thereof

A multi-mode power amplifier and an electronic device including the amplifier are described.

Multiple output power mode amplifier

A multiple power mode amplifier provides a low and a high power mode without using switches. This amplifier may be used in radio frequency (RF) applications such as mobile telephones, pagers, portable digital assistants, and wireless e-mail devices. In the low power mode, the power consumption of the amplifier is reduced, which will increase operation time, especially important for battery-operated devices. In one implementation, the amplifier includes a number of impedance matching network units (, and), impedance transformer (), and a power stage (). An implementation provides further power consumption savings by modulating a bias of an amplifier stage.

Multiple power mode amplifier with bias modulation option and without bypass switches

The present invention relates to a power amplification circuit of a mobile device for improving the efficiency and the linearity properties of the power amplifier. In one embodiment, the power amplifier improves these properties by controlling the input voltage of the supplemental amplifier so that the power amplifier operates as the Doherty mode in the low output power mode depending on the magnitude of the output power from the output unit and so that the input voltage of the supplemental amplifier may be increased up to satisfy the non-linear operational requirements of a power amplifier in the high output power mode. Moreover, because only the input voltage of the supplemental amplifier is controlled, the power amplifier can be implemented in a simple manner. Thus, the size of the power amplifier becomes small, which in turn reduces the cost of the power amplifier, among other things.

Power amplification apparatus of portable terminal

Power amplification apparatus of a portable terminal

A multiple power mode amplifier provides a low and a high power mode without using switches. This amplifier may be used in RF applications such as mobile telephones. In the low power mode, the power consumption of the amplifier is reduced, which will increase operation time, especially important for battery-operated devices. In one implementation, the amplifier includes a number of impedance matching network units, impedance transformer, and a power stage.

High efficiency power amplifier

Growing community of inventors

Seongnam-si, South Korea

Youngwoo Kwon