Samsung Electronics Co., Ltd.

Youngsoo Jang

Yongwook Hwang

Jinho Lee

Changyoun Hwang

Byounghee Choi

Yunsung Ha

Minwoo Yoo

Bonggyu Kang

Junghyeon Hwang

Heesu Kim

Yongha Kim

Hyeonwoo Lee

Sungjin Park

Sunghoon Kim

Jihyun Kim

Minsung Lee

Manho Kim

KwangSoo Park

Junsik Park

Chiyoung Park

Hyunjung Jeong

Sanggyou Choi

Yoo Minwoo

Electronic device including first plate including first flat surface portion facing first direction, wherein first plate forms first surface of electronic device; second plate including second flat surface portion facing second direction opposite first direction, wherein second plate forms second surface of electronic device; side member including first metal part including first metallic material and forming at least part of third surface between first surface and second surface and second metal part including second metallic material, wherein second metal part is bonded with first metal part; and display disposed between first plate and the second plate so as to be shown through the first plate, wherein the first metal part and the second metal part form an interface including the first metallic material and the second metallic material, and wherein the interface is configured to face a third direction that is perpendicular to the first direction and the second direction.

Electronic device including housing containing metallic materials

A semiconductor package includes a package board, at least one semiconductor chip disposed on the package board, a molding member disposed on the package board and at least partially surrounding the at least one semiconductor chip, and a heat dissipation member disposed on the at least one semiconductor chip and the molding member. The molding member has first region in which a plurality of uneven structures are disposed, and a second region spaced apart from an external region by the plurality of uneven structures. The plurality of uneven structures protrude to a predetermined height away from the semiconductor chip, the molding member, and the heat dissipation member, and may be formed as a part of the head dissipation member, or formed separately.

Semiconductor package including uneven structures and electronic device including the same

An electronic device includes a substrate, a first plate having a first internal surface facing a first surface of the substrate, and at least one first through-hole and at least one second through-hole, first and second semiconductor packages spaced apart from each other between the first surface and the first internal surface, a first thermal interface material layer contacting an upper surface of the first semiconductor package and the first internal surface, and filling at least a portion of the at least one first through-hole, and a second thermal interface material layer contacting an upper surface of the second semiconductor package and the first internal surface, and filling at least a portion of the at least one second through-hole. At least one of side surfaces of the first and second thermal interface material layers is exposed to an empty space between the first internal surface and the first surface.

Electronic device including thermal interface material layer and semiconductor package

Various embodiments of the disclosure provide an electronic device including a housing having a double texture, and a method for manufacturing the same. According to various embodiments disclosed herein, there may be provided an electronic including a housing that includes a first surface having a first surface roughness, a second surface having a second surface roughness different from the first surface, and a first connection portion between the first surface and the second surface. The electronic device may further include an oxide film layer disposed on the first surface, the second surface, and the first connection portion and configured to have a substantially uniform thickness. Various other embodiments may be applied.

Electronic device including housing and manufacturing method thereof

An electronic device includes a first housing including a first surface and a second surface; a second housing including a third surface and a fourth surface; a hinge structure; a camera module disposed within the first housing; and a first magnet disposed within the second housing and facing the camera module. The camera module includes: a case including one surface facing the first surface and the another surface facing the second surface and spaced apart from the first surface; a lens assembly movable within the case; and an actuator accommodating a second magnet and including a carrier configured to move the lens assembly in a direction toward the one surface of the case or a direction toward the other surface of the case; and the first magnet limits the movement of the lens assembly by interaction with the second magnet when the electronic device is in the folding state.

Electronic device including structure that reduces vibration in camera module

In a method of manufacturing an integrated circuit involving performing an electrostatic discharge (ESD) test, a weak frequency band is detected by sequentially radiating a plurality of first electromagnetic waves on a first test board including the integrated circuit. First peak-to-peak voltage signals are detected by sequentially radiating the plurality of first electromagnetic waves on a second test board including an electromagnetic wave receiving module. A frequency spectrum is detected by radiating a second electromagnetic wave on a housing including a third test board including the electromagnetic wave receiving module. A second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signals and the frequency spectrum. An ESD characteristic associated with an electronic system including the integrated circuit is predicted based on the second peak-to-peak voltage signal.

Method of manufacturing an integrated circuit involving performing an electrostatic discharge test and electrostatic discharge test system performing the same

A device, a house for the device and a method are disclosed herein. The device includes a first plate, a second plate facing an opposite direction, a side member integrally formed with the second plate, surrounding a space between the first the second plate, and a mid-plate coupled to the side member, extending into the space, the side member further including an aluminum substrate layer formed between a first and second surface exposed within the space, an aluminum oxide layer formed between the first surface and the aluminum substrate layer including multiple pores, a first layer formed conformally between the first surface and the aluminum oxide layer along the multiple pores and a surface of the aluminum oxide layer, the first layer comprising titanium, and a second layer formed on the first layer as to form the first surface, the second layer comprising titanium.

Housing including metal material and electronic device including same

An electronic device is provided. The electronic device includes a frame structure, and the frame structure includes an outer metallic portion including a first metallic material and forming at least a portion of an outer surface of the electronic device, and an inner metallic portion including a second metallic material different from the first metallic material and laterally surrounded by the outer metallic portion, and a first inner polymeric portion isolated from the inner metallic portion and at least partially laterally surrounded by the outer metallic portion. The electronic device includes a wireless communication circuit electrically connected to a portion of the outer metallic portion.

Electronic device with waterproof structure

Growing community of inventors

Gyeonggi-do, South Korea

Youngsoo Jang