Samsung Electronics Co., Ltd.

Youngshin Kwon

Sang-Uk Han

Jeong-Kyu Ha

KwanJai Lee

Sungeun Jo

Inho Choi

Jae-Min Jung

KyongSoon Cho

Woonbae Kim

Eunhee Jung

Minjin Kim

Youngdoo Jung

Seung Hwan Kim

An image sensor package including an image sensor chip including an active pixel sensor region and a non-sensing region, a plurality of chip pads being in the non-sensing region; a printed circuit board on one side of the image sensor chip, the printed circuit board including a plurality of bonding pads; conductive wires respectively connecting the plurality of chip pads to the plurality of bonding pads; a bonding dam at a periphery of the active pixel sensor region; a cover glass on the bonding dam and facing another side of the image sensor chip; and an encapsulation layer covering a side surface of the bonding dam, a side surface of the cover glass, an edge of a lower surface of the cover glass, the non-sensing region, and an edge of an upper surface of the printed circuit board, wherein the bonding dam is spaced apart from an end of a side surface of the image sensor chip by a distance of 80 &#x3bc;m to 150 &#x3bc;m has a height of 50 &#x3bc;m to 150 &#x3bc;m from the image sensor chip, and has a width of 160 &#x3bc;m to 240 &#x3bc;m.

Image sensor package

Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

Sensor package, method of manufacturing the same, and method of manufacturing lid structure

A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.

Methods of fabricating tape film packages

Tape film packages and methods of fabricating the same

Provided are methods of forming semiconductor modules. The method includes forming a high polymer material layer having an adhesive property on a support substrate, adhering a semiconductor chip to the support substrate using the high polymer material layer, bonding the semiconductor chip adhered to the support substrate to a flexible panel, and removing the support substrate.

Methods of forming semiconductor modules including flexible panels

Growing community of inventors

Suwon-si, South Korea

Youngshin Kwon