Semes Co., Ltd.

Youngseo An

Junho Kim

Man Kyu Kang

Kyungjin Seo

Kyungsik Shin

Jaeoh Bang

Jinki Shin

Yoonki Sa

An apparatus for treating a substrate includes a process chamber having a process space therein, a support unit that supports the substrate in the process space, a heating member that heats the substrate supported on the support unit, and an exhaust unit that evacuates the process space. The exhaust unit includes an exhaust duct and a heat retention unit having a retention space that retains heat released from the process space. The retention space surrounds an adjacent area located adjacent to the process chamber in the exhaust duct.

Apparatus and method for treating substrate

An apparatus for treating a substrate includes a housing having a treatment space inside, a gas supply unit that supplies a hydrophobic gas into the treatment space to hydrophobicize the substrate, and a support unit that supports the substrate in the treatment space. The support unit includes a support plate, a heating member that heats the substrate placed on the support plate, and a height adjustment member that changes a position of the substrate between a first position spaced apart upward from an upper surface of the support plate by a first distance and a second position spaced apart upward from the upper surface of the support plate by a second distance, and the second position is a higher position than the first position.

Support unit, substrate treating apparatus including the same, and substrate treating method using the substrate treating apparatus

Growing community of inventors

Osan-si, South Korea

Youngseo An