Samsung Electronics Co., Ltd.

Google Inc.

Youngsang Cho

Yunhyeok Im

Heeseok Lee

Sungsoo Lim

Chunghyun Ryu

Minsung Kil

Moonseob Jeong

A semiconductor package includes a first interconnection structure, a first semiconductor chip disposed on the first interconnection structure and including a plurality of through-vias and first pads connected to the plurality of through-vias; a second semiconductor chip disposed on the first interconnection structure, including second pads electrically connected to the first pads, and having a size different from a size of the first semiconductor chip; a heat dissipation structure contacting and surrounding side surfaces of at least one of the first semiconductor chip and the second semiconductor chip, and including a material having higher thermal conductivity than a thermal conductivity of silicon; and an encapsulant surrounding side surfaces of the heat dissipating structure.

Semiconductor package having improved heat dissipation characteristics

A semiconductor package includes a first substrate, a semiconductor chip disposed on the first substrate, a mold layer disposed on the first substrate and at least partially covering the semiconductor chip, and a heat dissipation structure disposed on a first top surface of the semiconductor chip and in the mold layer. The heat dissipation structure covers an inner side surface of the mold layer. A surface roughness of the first top surface of the semiconductor chip is greater than a surface roughness of a side surface of the semiconductor chip, and a surface roughness of the inner side surface of the mold layer is greater than a surface roughness of a top surface of the mold layer. The heat dissipation structure includes voids therein.

Semiconductor package including a heat dissipation structure

In a method of resetting a storage device, an internal power supply voltage is generated based on an external power supply voltage. A first reset control signal that is activated when a level of the internal power supply voltage is higher than a reference level. A second reset control signal that is activated after a power-on of the storage device is completed or deactivated after a predetermined delay time from when the external power supply voltage is turned off. A final reset control signal is generated based on the first reset control signal and the second reset control signal. The final reset control signal is activated when at least one of the first and second reset control signals is activated. After the external power supply voltage is turned off, a reset operation is performed when the final reset control signal is activated.

Method of resetting storage device, storage device performing the same and data center including the same

A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, an interposer on the lower semiconductor chip, the interposer including a plurality of pieces spaced apart from each other, an upper semiconductor chip on the interposer, and a molding member covering the lower semiconductor chip and the interposer.

Semiconductor package

A semiconductor package includes: a first package substrate; a first semiconductor device mounted on the first package substrate; a second package substrate arranged on an upper part of the first semiconductor device; and a heat-dissipating material layer arranged between the first semiconductor device and the second package substrate and having a thermal conductivity of approximately 0.5 W/m&#xb7;K to approximately 20 W/m&#xb7;K, wherein the heat-dissipating material layer is in direct contact with an upper surface of the first semiconductor device and a conductor of the second package substrate.

Semiconductor package and PoP type package

A semiconductor module may include a substrate including a first region and a second region, a first chip mounted in the first region, a second chip and passive devices mounted in the second region, and a heat dissipation layer being in contact with a top surface of the first chip. The heat dissipation layer may be provided on top surfaces and side surfaces of the first chip, the second chip and the passive devices.

Semiconductor module including heat dissipation layer

A method for dynamic bitrate selection for streaming media includes receiving one or more chunks from a first media stream of a plurality of bitrate media streams of a media file at a streaming buffer of the processing device, the plurality of bitrate media streams comprising a first subset of bitrate media streams including the first media stream and a second subset of bitrate media streams having a bitrate higher than a first bitrate of the first media stream. The method further includes monitoring a status of the streaming buffer by determining a buffer duration of the one or more chunks from the first media stream being buffered at the streaming buffer, calculating an expected download time for a subsequent chunk of the media file to be received at the streaming buffer in each bitrate media stream, selecting a bitrate media stream of the second subset of bitrate media streams based on expected download times calculated for the second subset of bitrate media streams and the playing time of the one or more chunks from the first media stream being buffered at the streaming buffer, and downloading the subsequent chunk from the selected bitrate media stream.

Dynamic bitrate selection for streaming media

A bitrate selector on a user device monitors a first stream of a plurality of bitrate media streams of a media file, the first media stream having a first bitrate, these plurality of bitrate media streams comprising a first subset of bitrate media streams including the first media stream and a second subset of bitrate media streams having a bitrate higher than the first bitrate. The bitrate selector calculates an expected download time for a subsequent chunk of the media file in each bitrate media stream of the second subset of bitrate media streams. The bitrate selector selects a bitrate media stream of the second subset of bitrate media streams for the subsequent chunk based on the expected download times and downloads the subsequent chunk from the selected bitrate media stream.

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Seoul, South Korea

Youngsang Cho