Stats Chippac Pte. Ltd.

Youngnam Choi

Tae Keun Lee

Cheonhee Lee

Kyungsic Yu

An integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.

Integrated circuit package system with leadframe substrate

An integrated circuit package system includes a substrate having an integrated circuit die thereon; a heat slug having a tie bar, the tie bar having characteristics of singulation from an adjacent heat slug; and an encapsulant molded on the substrate, the heat slug, and the integrated circuit die includes the encapsulant which fills all of the space between the integrated circuit die and the heat slug.

Integrated circuit package system using heat slug

An integrated circuit package system includes providing a substrate having an integrated circuit die thereon. A support is provided on the substrate. A heat slug having a tie bar is positioned by the tie bar on the support. The substrate and the integrated circuit die are encapsulated with an encapsulant, the encapsulant in contact with the heat slug. The substrate, heat slug, and encapsulant are singulated to remove the support.

A system for manufacturing an integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.

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Seoul, South Korea

Youngnam Choi