Samsung Electronics Co., Ltd.

Lg Electronics Inc.

Ajou University Industry-Academic Cooperation Foundation

Youngmin Lee

Hyungsuk Kim

Hyukjun Jang

Jooseung Kim

Sungho Seo

Hwaseok Oh

Eunjun Cho

Minsoo Kim

Hyoseok Na

Sungyeol Kim

Dongil Yang

JinHyeok Choi

Insu Song

Hyunseok Choi

Kyehoon Lee

Yongjun An

Seungyong Shin

Woojin Kim

Chunsoon Park

Inyoung Lee

Sungdong Cho

Yongho Lee

Wooyong Lee

Jinhwan Park

Junsung Choi

Kyungsoo Park

Jaewook Lee

Jinwoo Kim

Jinwoo Park

Jihoon Kim

Hyungjin Kim

Jongin Lee

Dasom Lee

Jaekyung Yang

Minsung Kim

Sunyoung Kim

Sangsoo Kim

Kwangmyung Cho

Hyunki Kim

Pilhyun Yoon

Hyuntae Park

Jihyeong Ryu

Sangcheon Park

Dukjin Jeon

Jaewoo Kim

Kwangwuk Park

Hojin Seo

Younghwan Moon

Seokhwan Jeong

Changjun Lee

Byoungjin Cho

Jaechan Park

Youngja Kim

Gihwan Kim

Hyoungyol Mun

Jongbin Kim

Ji-Seung Youn

Gyuseok Choe

Hyosung Park

Yun-Rae Cho

Taeyeon Kim

Seokho Kim

Hanyeop Lee

Kwanwoo Noh

Seongbeom Hong

Hwayoung Cho

Won-Gi Hong

Eunji Kim

Junghwan Son

Kyuha Lee

Myungsub Shin

Minchul Shin

Inseok Yoo

Junghyeong Ha

Kunsang Park

Heungsik Choi

Yunbum Lee

Haesung Jung

Yonghun Kwon

Hojun Jaygarl

Eunchul Ahn

Myungsang Kim

Junga Lee

Yuseon Lee

Jinwoong Kim

Youngju Kim

Hyoungwook Lim

Soongmann Shin

Aram Shin

Seongyong Jang

Eunkyoung Yoon

Taewha Choi

Kwangbin Lee

Juho Van

Junhong Kim

Sangmin Jung

Jeongho Kang

Donghee Suh

Minyong Jung

Youngbin Kim

A semiconductor package includes a first structure having a first insulating layer and a first bonding pad penetrating the first insulating layer, and a second structure on the first structure and having a second insulating layer bonded to the first insulating layer, a bonding pad structure penetrating the second insulating layer and bonded to the first bonding pad, and a test pad structure penetrating the second insulating layer and including a test pad in an opening penetrating the second insulating layer and having a protrusion with a flat surface, and a bonding layer filling the opening and covering the test pad and the flat surface, the protrusion of the test pad extending from a surface in contact with the bonding layer, and the flat surface of the protrusion being within the opening and spaced apart from an interface between the bonding layer and the first insulating layer.

Semiconductor package

An electronic device may include a transceiver, a communication circuit, at least one antenna circuit, a processor, and a memory. The transceiver may include at least one transmission (Tx) chain and at least one reception (Rx) chain. The communication circuit may include a plurality of front ends electrically connected to the transceiver. The at least one antenna circuit may be connected to the plurality of front ends, respectively. The processor may be operatively connected to the communication circuit. The processor is configured to change the power and/or circuit driving of the at least one reception (Rx) chain on the basis of the strength of an output signal of the at least one transmission chain.

Electronic device including antenna modules and operation method thereof

An electronic device include an antenna, a power amplifier and at least one processor configured to identify, transmit power of user data to be transmitted within a first slot in which uplink transmission is initiated; switch, based on identifying that the user data is transmitted based on a first SCS, supply voltage for dynamic range of the PA to a voltage value corresponding to the Tx power; switch, based on identifying that the user data is transmitted based on a second SCS greater than the first SCS, the supply voltage to the voltage value, within second duration in the second slot, the second duration in the second slot being before an initiation of the first slot; and transmit, using the PA, the user data with the Tx power within the first slot, to the base station.

Electronic device and method for controlling transmit power

A heat pump is provided that includes a first pipe in which a first refrigerant flows; a second pipe disposed at a side of the first pipe and in which a second refrigerant flows; a first heat exchanger connected with the first pipe and the second pipe and in which the first refrigerant exchanges heat with the second refrigerant; a boiler connected with the first pipe and in which the first refrigerant flows; a compressor connected with the second pipe and that compresses the second refrigerant; a second heat exchanger connected with the second pipe and in which the second refrigerant exchanges heat with outdoor air; a bypass pipe branched from first pipe and configured to exchange heat with the second heat exchanger; and a three-way valve that directs the first refrigerant to pass through the bypass pipe. When the outdoor heat exchanger operates as an evaporator, frost formation thereon may be prevented.

Heat pump

A storage device and an operating method of the same are disclosed. The storage device includes a memory controller and a non-volatile memory, wherein the memory controller is configured to calculate a number of zones, which are spaces allocated to logical addresses, based on a cell area size of first storage areas of the non-volatile memory, and provide the number of zones to a host, is configured to generate multiple zones of a number within the calculated number of zones, and to map a logical address of each zone to a physical address of at least one of the first storage areas, and is configured to, in response to a first write request from the host, write data included in the first write request into first storage areas corresponding to a zone indicated by the first write request.

Storage device with variable cell area size and operating method thereof

An operating method of a storage device, including a core and a memory, includes receiving a first processing code configured to enable execution of a first task and storing the first processing code in a first logical unit separately allocated in the memory for near-data processing (NDP), in response to a write command received from a host device, activating the core for executing the first processing code, in response to an activation command received from the host device, and executing the first task by using the core, in response to an execution command received from the host device.

Storage device for executing processing code and operating method of the storage device

A solder reflow apparatus may include a reflow chamber, a heater and a stage. The reflow chamber may be configured to receive a heat transfer fluid. The heat transfer fluid may be configured for transferring heat to a solder for mounting an electronic part on a substrate. The heater may be configured to heat the heat transfer fluid in the reflow chamber. The stage may be in the reflow chamber to support the substrate. The stage may be inclined to a bottom surface of the reflow chamber to induce the heat transfer fluid toward a central portion of the substrate. Thus, the vertically ascended heat transfer fluid may be uniformly applied to the central portion and an edge portion of the substrate so that the solders at the central portion and the edge portion of the substrate may be uniformly soldered.

Solder reflow apparatus

A display apparatus includes a display panel, a plurality of light source substrates, a plurality of light sources mounted on the plurality of light source substrates and configured to emit light toward the display panel, a driving board configured to control operation of each of the plurality of light sources, a plurality of connectors electrically connected to the driving board by an electric wire and arranged on the plurality of light source substrates, and a bottom chassis including vertical borders extending and configured to support the plurality of light source substrates. Each of the plurality of light source substrates includes a substrate body, and a plurality of substrate bars horizontally extending from the substrate body. The substrate body of some of the plurality of light source substrates is farther from the vertical border of the bottom chassis in the horizontal direction than the plurality of substrate bars.

Display apparatus

A display apparatus includes: light sources and board bars on which the light sources are mounted, the board bars spaced apart from each other along a first direction, wherein each of the board bars comprises: a central extending portion extending in a second direction; first protrusions protruding from one side of the central extending portion with respect to the first direction, and arranged along the second direction, wherein first side light sources from among the light sources are on the first protrusions; first recess portions between adjacent pairs of the first protrusions, respectively; second protrusions protruding from another side of the central extending portion, opposite of the one side, and arranged along the second direction, wherein second side light sources from among the light sources are on the second protrusions; and second recess portions between adjacent pairs of the second protrusions, respectively.

Provided is a method of operating a storage system including a host device and a storage device, the method including: transmitting, by the host device, a first write command and a logical address to the storage device; transmitting, by the storage device, first normal offset information about a normal area and first cache offset information about a cache area included in a host memory of the host device to the host device; copying, by the host device, first write data stored in the normal area to the cache area based on the first normal offset information and the first cache offset information; and transmitting, by the storage device, a first response to the first write command to the host device, wherein reception of the first write data from the host device before transmitting the first response is omitted.

Storage system and method providing cache area in memory included in host device

A display apparatus includes a display panel, a printed circuit board defining an upper surface, a lower surface opposite the upper surface, and a through-hole, a plurality of light sources mounted on the upper surface of the printed circuit board and configured to emit light to the display panel, and a connector inserted into the through-hole on the upper surface of the printed circuit board. The connector includes a connector body inserted into the through-hole, and a plurality of connector terminals disposed in proximity to the upper surface of the printed circuit board. The connector terminals are configured to electrically connect the connector body to a portion of the printed circuit board, and may in certain embodiments connect a first portion of the printed circuit board on one side of the connector body to a second portion of the printed circuit board on an opposite of the connector body.

Connector, printed circuit board mounting the connector, and display apparatus including the same

A heat pump and a control method thereof are provided. The heat pump includes an outdoor unit includes a compressor that compresses a first refrigerant, a first outdoor heat exchanger that exchanges heat between the first refrigerant and outdoor air, an expansion mechanism that expands the first refrigerant, and a second outdoor heat exchanger that exchanges heat between the first refrigerant and a second refrigerant; a first refrigerant pipe that connects the compressor, the first outdoor heat exchanger, and the expansion mechanism, and through which the first refrigerant flows; a pressure sensor disposed in the first refrigerant pipe; a second refrigerant pipe connected to the second outdoor heat exchanger, and through which the second refrigerant flows; an indoor heat exchanger that is disposed in the second refrigerant pipe, and exchanges heat between indoor air and the second refrigerant; and a controller that determines a supply of the second refrigerant by determining a flow rate of the second refrigerant based on surging occurring in a pressure of the first refrigerant measured by the pressure sensor, so that the flow rate of the second refrigerant flowing through the second refrigerant pipe is determined only by the pressure value of the first refrigerant measured by the pressure sensor disposed in the first pipe, thereby determining the flow rate of the second refrigerant without a separate flow sensor.

Heat pump and control method therefor

A semiconductor package includes: a first structure having a first insulating layer disposed on one surface, and first electrode pads and first dummy pads penetrating through the first insulating layer, a second structure having a second insulating layer having the other surface bonded to the one surface and the first insulating layer and disposed on the other surface, and second electrode pads and second dummy pads that penetrate through the second insulating layer, the second electrode pads being bonded to the first electrode pads, respectively, and the second dummy pads being bonded to the first dummy pads, respectively. In the semiconductor chip, ratios of surface areas per unit area of the first and second dummy pads to the first and second insulating layers on the one surface and the other surface gradually decrease toward sides of the first and second structures.

A light source apparatus includes: a light source including a light emitting diode and an optical dome covering the light emitting diode; and a substrate supporting the light source, wherein the substrate may include: a conduction layer that is electrically conductive; a first protective layer disposed on the conduction layer and on which the optical dome is disposed, the first protective layer including a first exposed portion exposing a portion of the conduction layer to connect the conduction layer and the light emitting diode; and a second protective layer disposed on the first protective layer, the second protective layer including a second exposed portion exposing a portion of the first protective layer at which the optical dome is disposed on the first protective layer.

Light source apparatus and display apparatus

An operating method of a controller includes transmitting an extended status check command to a nonvolatile memory device, toggling a read activation signal /RE to correspond to the number of planes inside the nonvolatile memory device, after transmitting the extended status check command, and receiving status information of planes of the nonvolatile memory device through data lines according to a data strobe signal DQS corresponding to the read activation signal /RE.

Nonvolatile memory device, controller for controlling the same, storage device having the same, and operating method thereof

Growing community of inventors

Seoul, South Korea

Youngmin Lee