Stats Chippac Pte. Ltd.

YoungMin Kim

Ki Youn Jang

Hyung Jun Jeon

BaeYong Kim

Oh Han Kim

HyunChul Kang

A mock bump system includes: providing a first structure having an edge; and forming a mock bump near the edge.

Mock bump system for flip chip integrated circuits

A mock bump system includes providing a flip chip integrated circuit having an edge and forming a mock bump near the edge.

A method of manufacture of a shielded stacked integrated circuit packaging system includes: forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

Shielded stacked integrated circuit packaging system and method of manufacture thereof

A method of manufacture of a shielded stacked integrated circuit packaging system includes forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

A shielded stacked integrated circuit package system is provided including forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.

Growing community of inventors

Ichon-si, South Korea

YoungMin Kim