Micron Technology Incorporated

Youngkwon Jo

Won Joo Yun

Implementations described herein relate to various structures, integrated assemblies, and memory devices. In some implementations, a semiconductor package may include a substrate having a first plurality of substrate bond pads and a second plurality of substrate bond pads, and a semiconductor die having a first plurality of die bond pads and a second plurality of die bond pads. Each die bond pad, included in the first plurality of die bond pads, may be connected to a corresponding substrate bond pad, included in the first plurality of substrate bond pads, using bump bonding, and each die bond pad, included in the second plurality of die bond pads, may be connected to a corresponding substrate bond pad, included in the second plurality of substrate bond pads, using wire bonding.

Semiconductor package with hybrid wire bond and bump bond connections

Systems and methods of the present disclosure may involve a memory device that includes a command path. The command path may include a command decoder. The memory device may also include a clock path. The clock path may include a multiplexer coupled to the command path via one or more flip-flops. By including the multiplexer in the clock path, a reduced amount of processing bottleneck may occur in the command decoder.

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Meridian, ID, United States of America

Youngkwon Jo