Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Corporation

Seoul National University

Sungkyunkwan University

Youngki Lee

Dooseok Choi

Sunwoo Lee

Iljong Song

Yohan Jang

Hyounghwan Roh

Jaesuk Lee

Seungchan Heo

Youngmin Kim

Hongjong Park

Youngjae Jang

Daeyoung Yoon

Jungsik Park

Jongmin Kim

Woosup Lee

Sehwan Choi

Minsoo Kim

Thomas Byunghak Cho

Keuncheol Lee

Byeongtaek Moon

Joonhoi Hur

Kyeonghun Lee

Youngjig Kim

Hyoughwan Roh

Jaehyung Lee

Chui Hong Bae

Sungjin Shin

Taekyu Ha

Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.

Wideband antenna and antenna module including the same

A wireless communications device may include a controller configured to, in a calibration mode, obtain a first output value of a first power detector after setting a first power amplifier to a first gain and obtain a second output value of the first power detector after setting the first power amplifier to a second gain, wherein the controller may estimate, in a normal mode, output power of a first antenna from an output value of the first power detector, based on a correction coefficient calculated using the first output value and the second output value.

Device and method of estimating output power of array antenna

An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.

Transceiver using active device array and antenna module including the same

An electronic apparatus is provided. The electronic device includes: a communication interface comprising communication circuitry; a memory storing information for correcting a signal received from each of a plurality of other electronic devices; and a processor connected to the memory and the communication interface and configured to control the electronic device, wherein the processor is configured to: control the communication interface to perform communication with another electronic device operating as a software enabled access point, identify another electronic device that has transmitted a signal among the plurality of other electronic devices based on the signal based on the signal being received from another electronic device through the communication interface, and correct the received signal based on correction information corresponding to another electronic device among the information stored in the memory.

Electronic device and control method thereof

An antenna device includes an antenna space, a barrier, a signal processing device, and a feed space. The antenna space includes first and second antennas that transmit/receive first and second radio frequency (RF) signals in different bands. The barrier includes a penetration region, is disposed adjacent to the antenna space, and reflects the first and second RF signals. The signal processing device adjacent to the barrier, includes first and second RF circuits that process the RF signals. The feed space includes first and second feed layers and is disposed adjacent to and stacked on the signal processing device, and adjacent to the barrier. A first feed line connecting the first RF circuit to the first antenna passes through the first feed layer and the penetration region, and a second feed line connecting the second RF circuit to the second antenna passes through the second feed layer and the penetration region.

Multi-band antenna device

A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.

Antenna module and radio frequency apparatus including the same

An antenna device includes a first antenna, a second antenna, a barrier, and a signal processing device. The first antenna transceives a first radio frequency (RF) signal in a first communication band, and the second antenna transceives a second RF signal in a second communication band. The first antenna includes a first radiator and a second radiator having a shape symmetrical to a shape of the first radiator. The second antenna includes third and fourth radiators having shape identical to those of the first and second radiators but having a size corresponding to the second communication band. The barrier includes a penetration region, and reflects the first and second RF signals. A center frequency of the second communication band is higher than a center frequency of the first communication band, and the first and second antennas are connected with the signal processing device through the penetration region of the barrier.

A method of manufacturing an open-cell type of porous aluminum includes: manufacturing a space-holder by using a water-soluble salt powder; stacking the space-holder in a container, and manufacturing an open-cell type of porous aluminum by injecting molten aluminum.

Open-cell type porous aluminum manufacturing method and open-cell type porous aluminum manufactured thereby

An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.

Disclosed is an electronic device which includes: a metal body including a hole defined by an inner edge thereof and extending in a first direction, wherein the metal body is defined by an outer edge thereof; and a near field communication (NFC) antenna including a coil wound about a central axis and arranged near the metal body to overlap the hole in a plan view of the metal body, wherein the inner edge and the outer edge are not connected to each other and the NFC antenna is arranged at the center of the hole along a second direction perpendicular to the first direction, and wherein the NFC antenna is arranged such that four cross points at which the NFC antenna and the inner edge cross in the plan view are formed.

Electronic device including NFC antenna

An antenna of a near field wireless communication device is provided. The antenna may include: a source coil pattern formed on one surface of a flexible printed circuit board (FPCB) and formed with a first conductive line between a first antenna port and a second antenna port; a resonance coil pattern formed with a second conductive line, which electrically separates from the source coil pattern; and a capacitor pattern electrically connected to the second conductive line, wherein one terminal of the capacitor pattern is connected to a first terminal of the second conductive line and the other terminal of the capacitor pattern is connected to a second terminal of the second conductive line through a third conductive line formed on the other surface of the FPCB.

Near field communication antenna

An electronic device that includes a near field communication (NFC) antenna and a mobile device is provided. The NFC antenna includes a first coil and a second coil separated from the first coil. The mobile device includes the first coil. The second coil is arranged on the outside of the mobile device.

Growing community of inventors

Incheon, South Korea

Youngki Lee