Micron Technology Incorporated

Youngik Kwon

Jong Sik Paek

Yeongbeom Ko

Jungbae Lee

Stacked semiconductor dies for semiconductor device assemblies and associated methods and systems are disclosed. In some embodiments, the semiconductor die assembly includes a substrate with a first opening in an inner portion and a second opening in an outer portion of the substrate. Further, the semiconductor die assembly can include a master die attached to a front side of the substrate, where the master die includes a first bond pad proximate to the first opening and a second bond pad proximate to the second opening. The first and second bond pads of the master die can be coupled with first and second substrate bond pads on a back side of the substrate, opposite to the front side, using first and second bonding wires extending through the first and second openings, respectively.

Stacked semiconductor dies for semiconductor device assemblies

Semiconductor device assemblies with improved ground connections, and associated systems and methods are disclosed. In one embodiment, a semiconductor device assembly may include one or more semiconductor dies mounted on an upper surface of a package substrate. Further, the package substrate includes a bond pad disposed on the upper surface, which may be designated as a ground node for the semiconductor device assembly. The bond pad may be electrically connected to an electromagnetic interference (EMI) shield of the semiconductor device assembly through a conductive component attached to the bond pad and configured to be in contact with the EMI shield at a sidewall surface or a top surface of the semiconductor device assembly, thereby forming the ground connection. Such ground connection may reduce a processing time to form the EMI shield while improving yield and reliability performance of the semiconductor device assemblies.

Ground connection for semiconductor device assembly

This patent application relates to microelectronic device packages with internal EMI shielding, methods of fabricating and related electronic systems. One or more microelectronic devices of a package including multiple microelectronic devices are EMI shielded, and one or more other microelectronic devices of the package are located outside the EMI shielding.

Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems

A mold chase for packaging a compartmentally shielded multifunctional semiconductor is provided. The mold chase generally includes a first cavity and a second cavity separated by a trench plate positioned between a first component and a second component of the multifunctional semiconductor between which a compartmental shield is required. The mold chase is lowered into a molding position over the multifunctional semiconductor and a molding material is injected through an inlet sprue into the first and second cavities to surround the first and second components, respectively. After the molding material is cured, the mold chase is removed and an open trench is formed in the cured molding material by the trench plate. The open trench is filled with a conductive material to form the compartmental shield. A conformal shield may be added to cover the package.

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Taichung, Taiwan

Youngik Kwon