Semes Co., Ltd.

Younghun Jung

Min Jung Park

Kisang Eum

Choongki Min

Soo Hyun Cho

Kyungjin Seo

Chang Uk Park

Jongwha Kang

Kwangsoo Kim

Sunwook Jung

Junghyun Lee

Wooram Lee

Youngjun Lee

Dongwoon Park

Juyeon Cho

A substrate processing apparatus includes a bake chamber, a chamber door that opens and closes an opening of the bake chamber, a first support plate in the bake chamber, a first partition wall, which partitions a space provided on the first support plate into first heat treatment spaces spaced apart from each other in a first horizontal direction, and extends in a second horizontal direction and a vertical direction, first heat treatment modules arranged in the first heat treatment spaces, a first exhaust duct extending in the first horizontal direction across the first heat treatment spaces, a first sealing bracket coupled to the first exhaust duct, a first horizontal packing configured to seal a gap between the first sealing bracket and the chamber door, and a first vertical packing configured to seal a gap between the first partition wall and the chamber door.

Substrate processing apparatus

An apparatus for treating a substrate includes a heat treatment chamber having an interior space, a housing that is provided in the interior space and that has a treatment space therein, a gas supply line that supplies, into the treatment space, a hydrophobic gas for hydrophobicizing the substrate, and a decomposition unit that decomposes an alkaline gas leaking from the treatment space to the interior space.

Apparatus for treating substrate

Embodiments of the inventive concept relate to an apparatus and a method for removing a liquid residing on a substrate. The substrate treating apparatus includes a substrate support unit configured to support the substrate, a liquid supply unit configured to supply a liquid onto the substrate supported by the substrate support unit, and a heating unit configured to heat the substrate supported by the substrate support unit, wherein the substrate support unit includes a support plate having a seating surface, on which the substrate is seated, and having a suction hole on the seating surface, a rotary shaft configured to rotate the support plate, and a vacuum member configured to reduce a pressure of the suction hole such that the substrate seated on the seating surface is vacuum-suctioned on the support plate. Accordingly, the drying efficiency of the substrate may be increased.

Apparatus and method for treating substrate

Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a support unit provided to support the substrate and rotate the substrate; a treatment liquid nozzle for supplying the treatment liquid onto the substrate supported by the support unit; a pre-wet liquid nozzle for supplying a pre-wet liquid onto a substrate supported by the support unit; and a controller for controlling the treatment liquid nozzle and the pre-wet liquid nozzle, wherein the controller controls the treatment liquid nozzle and the pre-wet liquid nozzle to perform a pre-wet step for supplying the pre-wet liquid to the substrate, and then a treatment liquid supply step for supplying the treatment liquid to the substrate and supplying the pre-wet liquid to the substrate during the supplying the treatment liquid to the substrate.

Growing community of inventors

Asan-si, South Korea

Younghun Jung