Samsung Electronics Co., Ltd.

YoungHoon Ro

Woojae Kim

Sungwoo Park

Yonghwan Kwon

HanShin Youn

Seung Hwan Kim

Jung-Ho Park

Yunseok Choi

Eun-Seok Song

Yechung Chung

In Won O

Han-shin Youn

Package substrates, semiconductor packages including the package substrates, and methods for fabricating the semiconductor packages are provided. A package substrate may include a core including a first surface on which a semiconductor chip is disposed and a second surface opposite the first surface. The package substrate may also include a metal pad on the second surface of the core. The metal pad may include a saline water corrosion resistant surface.

Package substrates, semiconductor packages having the package substrates

An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.

Package for semiconductor device including guide rings and manufacturing method of the same

Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is electrically connected to the film substrate through a first connection member which contacts the semiconductor chip and the metal wiring; and the film substrate is electrically connected to the at least one lead through a second connection member which contacts the metal wiring and the at least one lead.

Semiconductor packages

Provided is a chip-on-board package. The chip-on-board package may include a board, a grounding pad on a first surface of the board, the grounding pad including a body portion and at least one line portion, and at least two conductive pads on the first surface, the at least two conductive pads being arranged adjacent to the body portion. The at least one line portion may extend between the at least two conductive pads and the at least one line portion may have a narrower width than the at least two conductive pads.

Chip-on-board package

Growing community of inventors

Hwaseong-si, South Korea

YoungHoon Ro