Samsung Electronics Co., Ltd.

Younggu Jin

Youngchan Kim

Yonghun Kwon

JungChak Ahn

Taesub Jung

Moosup Lim

Min Hee Jang

Min-Sun Keel

Youngsun Oh

Junsung Park

Seunghyun Lee

Min-Ho Kim

Eunsub Shim

Taeyon Lee

Changrok Moon

Taechan Kim

Gwideokryan Lee

Taeseok Oh

Seokha Lee

Sung-ho Choi

Daeyun Kim

Myungwon Lee

SangChul Sul

Duckhyung Lee

KwangHyun Lee

An image sensor is provided. The image sensor includes: a photoelectric conversion region in a semiconductor substrate; a photocharge collection region provided in the photoelectric conversion region; a floating diffusion region in the semiconductor substrate that is spaced apart from the photocharge collection region along a vertical direction; a charge multiplication region between the photocharge collection region and the floating diffusion region; and a vertical gate electrode which extends into the semiconductor substrate and overlaps the photocharge collection region along the vertical direction. A side surface of the vertical gate electrode is adjacent to the floating diffusion region and the charge multiplication region.

Image sensor

An image sensor includes a pixel isolation structure in a semiconductor substrate. The pixel isolation structure defines a plurality of pixel regions, a photoelectric conversion region in the semiconductor substrate on each of the pixel regions, a floating diffusion region in the semiconductor substrate and spaced apart from the photoelectric conversion region. A transfer gate electrode is disposed between the photoelectric conversion region and the floating diffusion region on each of the pixel regions. A dielectric layer is disposed on the semiconductor substrate and covers the transfer gate electrode. A plurality of active patterns spaced apart from each other is disposed on a top surface of the dielectric layer. A plurality of pixel transistors is disposed on corresponding active patterns. In a plan view, at least one of the active patterns overlaps a portion of the pixel isolation structure.

Image sensor having increased integration including active patterns overlapping a portion of a pixel isolation structure

A CMOS image sensor includes: a substrate including a plurality of unit pixel regions. The substrate includes: a first surface configured to receive light; a second surface opposite to the first surface; a deep device isolation portion disposed in the substrate and configured to isolate the plurality of unit pixel regions from each other, wherein the deep device isolation portion extends from the first surface toward the second surface and has a first depth measured from the first surface; a photoelectric conversion portion formed in the substrate in each of the plurality of unit pixel regions; and a first vertical reflection structure disposed in each of the plurality of unit pixel regions of the substrate and surrounded by the deep device isolation portion in a plan view.

CMOS image sensor

A method measures the distance between a time-of-flight (ToF) sensor and an object based on cross time shift. The ToF sensor includes at least one depth pixel and a light source to direct transmission light to an object. The depth pixel may have a multi-tap structure and may generate sampled data based on reception light and demodulation signals having different phases. The reception light corresponds to the transmission light reflected from the object. The method includes generating time shifts between the transmission light and demodulation signals, performing sampling operations to generate the sampled data corresponding to the time shifts, determining a cross time shift based on sampled data of a first reference tap substantially equaling sampled data of a second reference tap, and determining the distance between the ToF sensor and the object based on the cross time shift.

Time-of-flight sensor and method of measuring distance using the same

An image sensor for distance measurement and an image sensor module including the image sensor are provided. The image sensor includes: a pixel array including a plurality of pixels including a plurality of first pixels arranged on a first line and a plurality of second pixels arranged on a second line, wherein the plurality of first pixels and the plurality of second pixels are arranged to be staggered from each other, and each of the plurality of first pixels and the plurality of second pixels includes a plurality of modulation gates for receiving a plurality of modulated signals during a photocharge collection period; a row decoder that provides control signals and the plurality of modulated signals to the pixel array; and an analog-to-digital conversion circuit that receives a plurality of sensing signals from the pixel array and converts the plurality of sensing signals into a plurality of digital signals.

Image sensor for distance measurement and image sensor module including the image sensor

A depth pixel includes a first photodiode, a second photodiode and a common microlens. First and second taps are disposed at both sides of the first photodiode in a first horizontal direction to sample a photo charge stored in the first photodiode. The second photodiode is disposed at a side of the first photodiode in a second horizontal direction perpendicular to the first horizontal direction. Third and fourth taps are disposed at both sides of the second photodiode in the first horizontal direction to sample a photo charge stored in the second photodiode. The common microlens is disposed above or below the semiconductor substrate. The common microlens covers both of the first photodiode and the second photodiode to focus an incident light to the first photodiode and the second photodiode.

Depth pixel having multiple photodiodes and time-of-flight sensor including the same

An image sensor includes a substrate having a plurality of unit pixels, a photoelectric device portion and a storage device portion disposed in the substrate and constituting the plurality of unit pixels, a device isolation structure disposed in the substrate and partitioning the plurality of unit pixels, and an overflow gate providing an overflow path between the photoelectric device portion and the storage device portion according to a certain voltage, wherein the device isolation structure is partially opened at a boundary between the photoelectric device portion and the storage device portion.

Image sensor with a device isolation structure enclosing a plurality of pixels including an opening in plan view

A method of operating a time-of-flight (ToF) sensor including at least one depth pixel having a multi-tap structure and a light source illuminating a transmission light to an object is provided. An operation mode of a ToF sensor is determined among a distance detection mode to sense a distance to an object and a plurality of additional operation modes. A plurality of taps of a depth pixel and a light source are controlled based on the determined operation mode such that the plurality of taps generate a plurality of sample data corresponding to the determined operation mode. A sensing result corresponding to the selected operation mode is determined based on the plurality of sample data. A plurality of functions, in addition to a function of the ToF sensor to measure a distance to an object, may be performed efficiently by controlling the plurality of taps of the depth pixel and the light source depending on the operation modes.

Multi-function time-of-flight sensor and method of operating the same

An image sensor is provided. The image sensor includes a semiconductor substrate including a first surface and a second surface opposite to each other. A semiconductor pattern is disposed on the first surface of the semiconductor substrate and it extends in a first direction perpendicular to the first surface. A buried transmission gate electrode is disposed in a transmission gate trench extending from the first surface of the semiconductor substrate to an interior of the semiconductor substrate. A first gate electrode at least partially surrounds a side wall of the semiconductor pattern and has a ring-shaped horizontal cross-section. A color filter is disposed on the second surface of the semiconductor substrate.

Image sensor having a gate electrode on a semiconductor pattern side wall

An image sensor includes a device isolation layer disposed in a substrate and defining pixel regions, and a grid pattern on a surface of the substrate. The grid pattern overlaps the device isolation layer between adjacent pixel regions in a direction perpendicular to the surface. The grid pattern has a width less than a width of the device isolation layer.

Image sensors

A depth sensor includes a first pixel including a plurality of first photo transistors each receiving a first photo gate signal, a second pixel including a plurality of second photo transistors each receiving a second photo gate signal, a third pixel including a plurality of third photo transistors each receiving a third photo gate signal, a fourth pixel including a plurality of fourth photo transistors each receiving a fourth photo gate signal, and a photoelectric conversion element shared by first to fourth photo transistors of the plurality of first to fourth photo transistors.

Image sensor comprising entangled pixel

Provided is a depth sensor which includes a pixel and a row driver that controls the pixel, the pixel including a first tap, a second tap, a third tap, and a fourth tap, an overflow transistor, and a photoelectric conversion device. Each of the first tap, the second tap, the third tap, and the fourth tap includes a photo transistor, a transfer transistor, and a readout circuit. In a first integration period of a global mode, the row driver activates a second photo gate signal controlling the photo transistor of the second tap and a third photo gate signal controlling the photo transistor of the third tap. In a second integration period of the global mode, the row driver activates a first photo gate signal controlling the photo transistor of the first tap and a fourth photo gate signal controlling the photo transistor of the fourth tap.

Depth sensor and method of operating the same

Provided are a pixel array and an image sensor including the same. The pixel array includes a plurality of sub-pixels adjacent to each other and a readout circuit connected to the plurality of sub-pixels through a floating diffusion node. Each of the sub-pixels includes a photoelectric conversion element, an overflow transistor connected to the photoelectric conversion element, a phototransistor connected to the photoelectric conversion element and the overflow transistor, and a storage element connected to the phototransistor.

Pixel array and image sensor including the same

An electronic device includes a time of flight (ToF) sensor including a pixel array, a light source that emits light signals, and an optical device that projects the light signals to areas of an object which respectively correspond to a plurality of pixel blocks including pixels of the pixel array. Each of the pixels includes a plurality of taps each including a photo transistor, a first transfer transistor connected with the photo transistor, a storage element connected with the first transfer transistor, a second transfer transistor connected with the storage element, a floating diffusion area connected with the second transfer transistor, and a readout circuit connected with the floating diffusion area. An overflow transistor is disposed adjacent to the photo transistor and connected with a power supply voltage.

Electronic device including light source and ToF sensor, and LIDAR system

A depth pixel of a time-of-flight (ToF) sensor includes a common photogate disposed in a center region of the depth pixel, a plurality of floating diffusion regions disposed in a peripheral region surrounding the center region, a plurality of demodulation transfer gates disposed in the peripheral region, and a plurality of overflow gates disposed in the peripheral region. The demodulation transfer gates transfer a photo charge collected by the common photogate to the plurality of floating diffusion regions. The demodulation transfer gates are symmetric with respect to each of a horizontal line and a vertical line that pass through a center of the depth pixel and are substantially perpendicular to each other. The overflow gates drain the photo charge collected by the common photogate, and are symmetric with respect to each of the horizontal line and the vertical line.

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Suwon-si, South Korea

Younggu Jin