Samsung Electronics Co., Ltd.

Younggirl Yun

Taewook Ham

Younghoon Kim

Junghoon Park

Seungbo Shim

Haejin Lee

Junhee Han

Yongjin Woo

SungGeun Kang

Taekkyun Choi

Jaeyeon Ra

Myungsub Ko

Moonhyung Kwon

Juhyun Park

Jooho Jang

An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.

Heat dissipation structure and electronic device including same

According to certain embodiments, an electronic device comprises: a window forming at least a portion of a front surface of the electronic device; a cover forming at least a portion of a rear surface of the electronic device; a bracket disposed between the window and the cover; a printed circuit board supported by the bracket and disposed between the window and the cover; a shield can disposed on the printed circuit board covering a designated area of the printed circuit board; at least one communication processor disposed on the printed circuit board; and a mmWave antenna module connected to the printed circuit board, and electrically connected with the at least one communication processor via the printed circuit board, wherein the mmWave antenna module is disposed on the shield can and configured to transfer heat to the shield can.

Electronic device including mmWave antenna module

An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.

Electronic device using interposer in printed circuit board

Growing community of inventors

Gyeonggi-do, South Korea

Younggirl Yun