Jcet Stats Chippac Korea Limited

YoungEun Seo

Jinhyeok Song

DeokWoo Nam

A semiconductor device is tested by disposing an antenna-in-package (AiP) module under a test antenna. A first signal is transmitted with a first antenna of the AiP module. The test antenna is moved to a power output peak of the first signal. A second signal is transmitted with a second antenna of the AiP module. The test antenna is moved along a first directional axis from the power output peak of the first signal to a power output peak of the second signal while a second directional axis of the test antenna is held static. The first antenna of the AiP module is tested while the test antenna is at the power output peak of the first signal. The second antenna of the AiP module is tested while the test antenna is at the power output peak of the second signal.

Growing community of inventors

Incheon, South Korea

YoungEun Seo