Samsung Electronics Co., Ltd.

YoungBum Kim

Dongouk Kim

Dongjoon Lee

Sang-Yoon Kim

Akihiro Komatsu

Takahiro Tokumiya

Tatsuya Ishimoto

Yongin Lee

Hui-Jae Kim

Joongha Lee

Chaemook Lim

Yeongrack Son

Ohhyuk Kwon

Jaebong Shin

Byungjoon Lee

Kwanghyeon Jeong

Joong-Ha Lee

Jaeyeon Pyo

SeungDae Seok

Woohee Kim

A pressure heating apparatus that uniformly heats an object in a chamber in a short time includes a stage onto which the object is loaded; a heating light source that faces the stage, where the heating light source heats the object a non-contact manner while irradiating light onto the object; and a lower reflector disposed around the stage and that reflects light emitted from the heating light source toward the object.

Pressure heating apparatus

A process apparatus includes a heating module and a supporter disposed below the heating module. A process space is provided between the heating module and the supporter. The heating module includes a housing, at least one heating lamp disposed in the housing, at least one temperature sensor disposed in the housing, and a blocking plate disposed under the housing. The blocking plate spatially separates the at least one heating lamp from the process space, and the blocking plate includes at least one window spatially connecting the at least one temperature sensor to the process space.

Process apparatus including a non-contact thermo-sensor

A bonding apparatus includes a stage supporting a substrate, a first bonding head at a first side of the stage, the first bonding head to pick up a first chip and to bond the picked-up first chip onto the substrate, a second bonding head at a second side of the stage, the second bonding head to pick up a second chip and to bond the picked-up second chip onto the substrate, and a first image acquisition unit over a movement path of the stage to acquire an image of the stage.

Bonding apparatus

Growing community of inventors

Yongin-si, South Korea

YoungBum Kim