Amkor Technology, Inc.

Anam Semiconductor Inc.

Amkor Electronics, Inc.

Anam Industrial Co., Ltd.

Anam Industrial Col, Ltd.

Young Wook Heo

Il Kwon Shim

Byung Joon Han

Sun Ho Ha

Robert Francis Darveaux

Bruce J Freyman

John Briar

Kwon Shim

Robert Francis Darreaux

A bump chip scale semiconductor package. In the bump chip scale semiconductor package, the chip bumps are directly formed on the chip pads of a semiconductor chip. The above chip bumps are used as the signal input and output terminals of the package and are used as surface mounting joints when the chip is mounted to a mother board.

Bump chip scale semiconductor package

A method for marking poor quality printed circuit board units of a printed circuit board strip for ball grid array semiconductor packages wherein at least one degradation-indicating hole is at least partially formed in a poor quality printed circuit board unit of the strip at a region defined between an outer edge of the resin seal molding region of the unit and a cutting line formed on the printed circuit board strip to separate the unit from the strip. Even when a plurality of printed circuit board strips are packed in a vacuum under the condition in which they are stacked, there is no phenomenon that those strips in the pack are permanently deformed, for example, permanently bent. Also, there is no phenomenon that melt resin is leaked from the mold, thereby causing it to be bled out onto the upper surface of the printed circuit board strip. Since no paint is used to mark poor quality printed circuit board units, there is no problem associated with the use of the paint such as a contamination.

Marking Bad printed circuit boards for semiconductor packages

A printed circuit board for a BGA semiconductor package provided at one corner thereof with a degating opening serving as a mold runner gate during a process of molding a resin seal adapted to protect the semiconductor chip and serving as a region for degating a surplus resin formed after the molding process and a method for molding a BGA semiconductor using the printed circuit board. The degating opening has an inverted triangular shape having curved lateral sides and a vertex, at which the lateral sides join together, disposed in a region for forming the resin seal, or an inverted trapezoidal shape having one end disposed in the resin seal region. The invention can eliminate the peeling or damage of the upper surface of the printed circuit board occurring upon degating a surplus resin, the damage of the printed circuit board due to a torsion thereof, the damage of conductive traces on the printed circuit board, the exposure of the conductive traces caused by the damage of a solder mask, and the damage of a resin seal on the printed circuit board. Therefore, an improvement in productivity and reliability is achieved.

Printed circuit board for ball grid array semiconductor package

A chip size semiconductor package with a light, thin, simple and compact structure having a reduced size of its semiconductor chip while having an increased number of pins and without degrading its functions. For the package, it is possible to use either the semiconductor chip having bond pads arranged on end portions of the chip or the semiconductor chip having bond pads arranged on the central portion of the chip. In either case, input/output terminals of the package are arranged in the form of an area array. Accordingly, when the package is mounted on an electronic appliance, its mounting area can be minimized, thereby achieving a compactness of the final product.

Semiconductor package and assembly for fabricating the same

A ball grid array semiconductor package using a flexible circuit board, in which the flexible circuit board has no conductive via hole nor solder mask while having a thin structure formed at only one surface thereof with a circuit pattern having a small length. The flexible circuit board is mounted with a metallic carrier frame to achieve an easy handling thereof, a reduction in the inductance, impedance and coupling effect of adjacent circuit patterns and an easy discharge of heat from a semiconductor chip, thereby achieving an improvement in electrical performance and an improvement in heat discharge performance. The metallic carrier frame has a plurality of openings adapted to increase the bonding force between an encapsulate and constituting elements of the package, thereby removing a bending phenomenon of the package, and a method for fabricating such a BGA semiconductor package. The invention also provides a method for fabricating such a BGA semiconductor package.

Ball grid array semiconductor package with solder balls fused on printed

A semiconductor chip scale package and method of producing the package are disclosed. The package has a semiconductor chip having signal leading bumps. A PCB is electrically connected to the chip, thus transmitting input and output signals. A plurality of solder balls are formed on the lower surface of the PCB and are used as signal input and output terminals. An epoxy resin layer bonds the chip to the PCB. The PCB consists of a polymer resin substrate, a copper circuit pattern and a solder mask. The copper circuit pattern has a chip bump land and a solder ball land. The lands electrically connect the signal leading bumps to the solder balls. The package has a package size being similar to or slightly larger than a semiconductor chip within 120 % of the size of the chip.

Semiconductor chip scale package and method of producing such

A method of forming chip bumps of a bump chip scale semiconductor package, such a package and a chip bump are disclosed. In the bump chip scale semiconductor package produced by the above method, the chip bumps are directly formed on the chip pads of a semiconductor chip. The above chip bumps are used as the signal input and output terminals of the package and are used as surface mounting joints when the chip is mounted to a mother board.

Method of forming chip bumps of bump chip scale semiconductor package

A ball grid array semiconductor package includes a semiconductor chip mounted to the top side of a printed circuit board (PCB), having a copper circuit pattern at a position outside a chip mounting zone. A plurality of bond wires electrically connect the chip to the copper circuit pattern. A rectangular ring-shaped metal heat spreader is attached to the PCB surrounding the chip, with the outer periphery of the ring substantially coextensive with the outer periphery of the PCB. A molding compound is provided in a zone inside the heat spreader thus protecting the chip and wires from atmosphere, while the molding compound extends to a heat spreader portion, leaving other portions of the heat spreader exposed to atmosphere. A plurality of solder balls are included on the bottom side of the PCB and are used as signal input and output terminals of the package. The BGA package easily dissipates heat during the operation of the package, improving the operational reliability of the package. A plurality of grooves may be formed on the heat spreader, to improve the integrating force between the molding compound and the heat spreader and to protect the chip from moisture.

Ball grid array semiconductor package using a metal carrier ring as a

A method for reproducing a PCB strip for semiconductor packages, wherein a poor quality PCB unit included in the PCB strip is replaced with a normal quality one, thereby achieving a reduction in the amount of package materials used and an improvement in the process efficiency. The invention also provides a method for fabricating semiconductor packages using the PCB strip reproduction method. A desired portion of a poor quality PCB unit included in a PCB strip is cut out in such a manner that a cutting opening having a peripheral edge extending along the singulation line of the poor quality PCB unit or along a region defined between the singulation line and anti-bending slots of the poor quality PCB unit. In the cutting opening, a separate good quality PCB unit member having the same shape and size as the cutting opening is then fitted. Thus, it is possible to simply and efficiently replace PCB units determined to be of poor quality with separate good quality PCB unit members, respectively.

Method for reproducing printed circuit boards for semiconductor packages

A flexible circuit board for a ball grid array semiconductor package including a flexible resin film, a plurality of electrically conductive traces formed on an upper surface of the resin film, the conductive traces having solder ball pads, and a die flag including a semiconductor chip paddle located on a central portion of the circuit board, the chip paddle having a plurality of heat-discharging and grounding solder ball pads, and a plurality of lattice-shaped traces adapted to electrically connect the solder ball pads, the traces being shaped into a lattice to prevent a bleed-out of a silver-filled epoxy resin, a ground bonding rim located around the chip paddle, and a plurality of radial traces adapted to electrically connect the chip paddle to the ground bonding rim, and the flexible resin film being perforated to define solder ball lands on lower surfaces of the solder ball pads. Since the semiconductor chip paddle has an enlarged opened portion, it is possible to minimize the gold plated region, thereby greatly reducing the manufacturing costs. It is also possible to minimize a deformation of the package caused by mechanical stress generated due to a difference in thermal expansion coefficient between different materials of package elements. A bleed-out of silver-filled epoxy resin is also surely prevented.

Flexible circuit board for ball grid array semiconductor package

A process for manufacturing chip size semiconductor package with a light, thin, and compact structure having a reduced size of its semiconductor chip while having an increased number of pins For the package, it is possible to use either the semiconductor chip having bond pads arranged on end portions of the chip or the semiconductor chip having bond pads arranged on the central portion of the chip. In either case, input/output terminals of the package are arranged in the form of an area array. Accordingly, when the package is mounted on an electronic appliance, its mounting area can be minimized, thereby achieving a compactness of the final product.

Semiconductor package and method for fabricating the same

A unit printed circuit board (PCB) carrier frame used in the fabrication of a heat sink-attached ball grid array (BGA) semiconductor packages and a method for BGA semiconductor packages using the unit PCB carrier frame. The unit PCB carrier frame has a plurality of die pads each defined at its peripheral edges by elongated slots formed at a strip or reel-shaped frame member. For the fabrication of heat sink-attached BGA semiconductor packages, unit PCBs are bonded to the die pads of the unit PCB carrier frame. Accordingly, the bending of the packages is minimized even when they pass through subsequent processes requiring a high temperature. As a result, it is possible to obtain a maximum number of unit PCBs from a PCB panel, thereby achieving an improvement in productivity.

Unit printed circuit board carrier frame for ball grid array

A printed circuit board (PCB) having an epoxy barrier disposed around its throughout slot in a semiconductor chip mounting region, and a BGA semiconductor package using such a PCB, thereby exhibiting a high moisture discharge characteristic. The epoxy barrier includes a copper layer and a solder resist layer both disposed around the throughout slot and is defined by a groove which is disposed around the throughout slot while spacing apart from the periphery of the throughout slot by a desired distance. Alternatively, the epoxy barrier includes a solder resist layer formed to a desired width around the throughout slot on the uppermost layer laminated on the PCB. By virtue of the epoxy barrier, the throughout slot is not closed by epoxy resin coated over the PCB. As a result, it is possible to externally discharge moisture which expands in the PCB upon carrying out a series of processes for the fabrication of the package at a high temperature or mounting the package on a mother board. Accordingly, it is possible to eliminate interface peeling-off and formation of cracks. This results in an improvement in reliance of final products.

Printed circuit board having epoxy barrier around a throughout slot and

A BGA (ball grid array) semiconductor package with improved heat dissipation and dehumidification effect is disclosed. The above BGA package is provided with an open through slot on the chip mounting portion of the printed circuit board and/or the heat sink. The above through slot is occluded by neither the heat conductive epoxy resin nor the solder mask but is simply opened, thus directly exposing the bottom surface of the semiconductor chip to the outside of the package and effectively performing heat dissipation and dehumidification without causing any pop corn phenomenon during the dehumidification reflow. The size of the open through slot is not larger than the semiconductor chip. The open through slot is selected from among a rectangular slot, a large circular slot, a plurality of small circular slots, a radial slot, a cross slot or any combination thereof.

Ball grid array semiconductor package with improved heat dissipation and

A BGA (ball grid array) semiconductor package with a ring-type heat sink is disclosed. In the above package, the heat dissipating area is enlarged by extending the edge of a chip mounting die paddle formed of a copper or copper alloy layer to the outside of the package. The ring-type heat sink is attached to the extended portion of the die paddle such that the heat sink surrounds the encapsulant of the package. The above BGA package thus directly and effectively dissipates the chip's heat through the heat sink with high thermal conductivity. A plurality of plated through holes may be formed on the chip mounting portion of the PCB of the above package. The BGA package with both the ring-type heat sink and the PTHs, the heat dissipating effect of the package is further improved.

Growing community of inventors

Kyungki-do, South Korea

Young Wook Heo