Samsung Sdi Co., Inc.

Young Woo Park

Ji Yeon Kim

Ja Young Hwang

Kyoung Ku Kang

Kyoung Soo Park

Jae Sun Han

Kwang Jin Jung

Young Ju Shin

Kyoung Hun Shin

Byeong Geun Son

Young Min Kim

Eun Sun Yu

Ha Na Kim

Dong Wan Ryu

Misun Kim

Jinsuop Youn

Jiyoung Jeong

Soon Young Kwon

Gun Young Heo

Hyun Joo Seo

Youn Jo Ko

Janghyuk Kim

Chuljin Park

Provided are an ink composition, a layer prepared using the ink composition, and a display device comprising the layer, the ink composition comprising a solvent comprising (A) semiconductor nanorods, and (B) at least one diol-based compound, wherein the ink composition has a viscosity of at least 50 cps at 20° C. to 25° C. and at most 20 cps at 35° C. to 65° C.

Ink composition, layer using same, and display device

An anisotropic conductive film composition, an anisotropic conductive film prepared using the same, and a connection structure using the same, the anisotropic conductive film including a binder resin; a curable alicyclic epoxy compound; a curable oxetane compound; a quaternary ammonium catalyst; and conductive particles, wherein the anisotropic conductive film has a heat quantity variation rate of about 15% or less, as measured by differential scanning calorimetry (DSC) and calculated by Equation 1:Heat quantity variation rate (%)=[()/]&#xd7;100&#x2003;&#x2003;Equation 1

Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same

A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film having a differential scanning calorimeter onset temperature of 60&#xb0; C. to 85&#xb0; C., and a elastic modulus change of 30% or less, as calculated by Equation 1, below,Elastic modulus change(%)={()/}&#xd7;100&#x2003;&#x2003;[Equation 1] wherein Mis an initial elastic modulus in kgf/cmof the anisotropic conductive film as measured at 25&#xb0; C., and Mis a elastic modulus in kgf/cmof the anisotropic conductive film as measured at 25&#xb0; C. after the film is left at 25&#xb0; C. for 170 hours.

Semiconductor device connected by anisotropic conductive film

A semiconductor device connected by an anisotropic conductive film. The anisotropic conductive film includes a composition for an anisotropic conductive film including a first epoxy resin having an exothermic peak temperature of about 80&#xb0; C. to about 110&#xb0; C. and a second epoxy resin having an exothermic peak temperature of 120&#xb0; C. to 200&#xb0; C., as measured by differential scanning calorimetry (DSC). The first epoxy resin and the second epoxy resin are present in combined amount of about 30 wt % to about 50 wt % based on a total weight of the composition in terms of solid content. The second epoxy resin is present in an amount of about 60 to about 90 parts by weight based on 100 parts by weight of the first and second epoxy resins.

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Suwon-si, South Korea

Young Woo Park