Electronics and Telecommunications Research Institute

Young Tak Han

Sang Ho Park

Jang Uk Shin

Yong Soon Baek

Jong Hoi Kim

Duk Jun Kim

Yong Hwan Kwon

Yoon Jung Park

Hyun Soo Kim

Woo Jin Lee

Dong Hun Lee

Jin Tae Kim

O-Kyun Kwon

Oh Kee Kwon

Su Hwan Oh

Dong Soo Lee

Mun Seob Lee

Jong Deog Kim

Choon Gi Choi

Young Ahn Leem

Ki Soo Kim

Chun Ju Youn

Mi-Ran Park

Jong Sool Jeong

Bin Yeong Yoon

Sang Pil Han

Seo Young Lee

Hee Kyung Sung

Joong Seon Choe

Sung Woong Park

Byungseok Choi

Chul Wook Lee

Hee Keyng Sung

Hyun Do Jung

Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.

Multi-channel receiver optical sub-assembly and manufacturing method thereof

Provided herein is a radio frequency probe apparatus including a RF waveguide including a ground electrode and a signal electrode, a register connected to the signal electrode, a RF connector including an outer conductor connected to the ground electrode, an inner conductor connected to the signal electrode, and a dielectric body filling a portion between the outer conductor and the inner conductor, and a single tip probe connected to the signal electrode of the RF waveguide, or the register.

Radio frequency probe apparatus

There is provided a receiver optical module including a photodetector having a plurality of channels, a capacitor disposing block formed on an upper portion of the photodetector, a plurality of capacitors formed on the capacitor disposing block, and an electrical wiring configured to connect the plurality of capacitors to electrodes of a plurality of channels of the photodetector, wherein the plurality of capacitors are formed on the capacitor disposing block such that distance between the capacitors and the electrodes of the corresponding channels are the same. Distortion and loss of signal characteristics of high frequency can be reduced and quality of a signal can be enhanced.

Receiver optical module

Provided herein is a semiconductor optical device, including a waveguide including lattices buried therein and having a buried hetero (BH) structure formed in an optical oscillation region in which single mode light is oscillated, a waveguide having a deep ridge structure formed in an optical modulation region, and a passive waveguide formed in a mode transition region interposed between the optical oscillation region and the optical modulation region, formed as a connecting structure of the waveguide having the BH structure extending from the optical oscillation region and the waveguide having the deep ridge structure extending from the optical modulation region, and inducing evanescent optical coupling, wherein a width of the waveguide having the BH structure in the mode transition region is smaller than a width of the waveguide having the deep ridge structure in the optical modulation region.

Semiconductor optical device

Provided herein is an optical module including an optical bench having a first step with a first depth and a second step with a second depth that is smaller than the first depth; a silicon carrier disposed above the first step, and where at least one semiconductor chip is installed; an AWG chip (Arrayed Waveguide Grating chip) secured to the second step, extends up to the first step, and is chip-to-chip bonded with the silicon carrier above the first step; a lens disposed on an upper surface of the optical bench where the first step and the second step are not formed; and a metal package surrounding the optical bench, silicon carrier, AWG chip and lens, wherein at one side of the metal package, a double slit that includes an upper slit and a lower slit are formed, a DC FPCB (Direct Current FPCB) extends from outside towards inside the metal package through the upper slit and is secured to a support formed on an inner surface of the upper slit, and an RF FPCB (Radio Frequency FPCB) extends from outside towards inside the metal package through the lower slit and is secured to an upper portion of the silicon carrier, and the upper slit and the lower slit of the double slit being sealed by an elastic epoxy.

Optical module

Disclosed is a multi-channel receiver optical sub assembly. The a multi-channel receiver optical sub assembly includes: a multi-channel PD array, in which a plurality of photodiodes (PDs) disposed on a first capacitor, and including receiving areas disposed at centers thereof and anode electrode pads arranged in an opposite direction at an angle of 180 degrees based on the receiving areas between the adjacent PDs is monolithically integrated; a plurality of transimpedance amplifiers (TIAs) arranged on a plurality of second capacitors, respectively, and connected with the anode pads of the respective PDs through wire bonding; a submount on which the first capacitor.

Multi-channel receiver optical sub assembly

Provided is a wavelength division multiplexer/demultiplexer having a flat wavelength response. In the wavelength division multiplexer/demultiplexer, a modified taper-shaped optical waveguide is interposed between an input waveguide and a first slab waveguide, such that the distribution of an optical signal input to an Arrayed Waveguide Grating (AWG) has a sinc-function shape. Thus, a flat wavelength response can be obtained in an output waveguide. In addition, the modified taper-shaped optical waveguide interposed to obtain a flat wavelength response has a small size and a simple structure, and thus can be applied to a conventional wavelength division multiplexer/demultiplexer without a design change.

Wavelength division multiplexer/demultiplexer having flat wavelength response

Provided are a two-dimensional planar photonic crystal superprism device and a method of manufacturing the same, in which a manufacturing process is simplified using a nanoimprint lithography technique, and thus price-reduction and mass production are facilitated. The two-dimensional planar photonic crystal superprism device includes: a single-mode input waveguide comprising a straight waveguide having a taper structure and a bending waveguide; a superprism formed on an output end side of the single-mode input waveguide and comprising a slab and a photonic crystal superprism; and a single-mode output waveguide comprising a straight waveguide having a taper structure and a bending waveguide, and formed adjacent to the photonic crystal superprism. Using the two-dimensional planar photonic crystal superprism device, it is possible to facilitate manufacturing of nano-photonic integrated circuits, photonic crystal integrated circuits and nano-photonic systems. In addition, a wavelength-selectable photonic crystal superprism device using high dispersion of photonic crystal, which is several hundred times the dispersion of conventional glass prism, can be manufactured using thermal/hot and ultraviolet nanoimprint lithography techniques corresponding to nano-manufacturing technology.

Two-dimensional planar photonic crystal superprism device and method of manufacturing the same

Provided are high power PLC optical Tx module and PLC optical Tx/Rx module. The PLC optical Tx/Rx module is located in an OLT of a PON system. The high power PLC optical Tx/Rx module includes a photodiode, a laser diode, an SOA, an optical coupler, and a PLC platform. The photodiode converts an input optical signal into an electrical signal, and the laser diode generates an optical signal of a predetermined wavelength. The SOA amplifies the optical signal generated by the laser diode, and the optical coupler couples optical signals, outputs the coupled signal to a splitter, divides an optical signal from the slitter, and outputs the divided signals to the photodiode. The PLC platform incorporates the photodiode, the laser diode, the SOA, and the optical coupler into one package to allow an optical signal to be output with high power.

High power planar lightwave circuit optical Tx module and Tx/Rx module

Provided are a multi-wavelength optical transceiver module and a multiplexer/demultiplexer using a thin film filter. The multi-wavelength optical transceiver module includes: a PLC platform, on which a predetermined optical waveguide unit is formed and an optical transmitter is mounted; an optical fiber coupled to one side of the PLC platform to transmit a predetermined light; a plurality of thin film filters coupled to another side of the PLC platform to separate input optical wavelengths; and an optical receiver coupled to one side of the thin film filters to receive light that is input from the optical fiber and transmits the thin film filters, thereby enabling mass production of the optical transceiver module with low cost.

Multi-wavelength optical transceiver module, and multiplexer/demultiplexer using thin film filter

An optical waveguide platform and a method of manufacturing the same are disclosed. The optical waveguide platform comprises an optical waveguide having a lower clad layer, a patterned core layer and an upper clad layer which are laminated on one area of said substrate sequentially, a terrace formed by patterning said lower clad layer, on the other area of said substrate, a metal and a solder formed on said terrace and an optical device mounted on said terrace containing said metal and said solder. According to the present invention, the optical waveguide platform can be manufactured in a simple method without damaging the optical waveguide and the manufacturing cost thereof can be reduced.

Optical waveguide platform and method of manufacturing the same

Growing community of inventors

Daejeon, South Korea

Young Tak Han