Samsung Electronics Co., Ltd.

Isc Technology Co., Ltd.

Young-Soo An

Sang-Hoon Lee

Se-jang Oh

Jung-Hyeon Kim

Jong-Hak Won

Ho-Jeong Choi

Hak-soo Yu

Hyang-Ja Yang

Jung-Hyun Nam

Choong-Sun Shin

Kwang-Yong Lee

Jeong-Ho Bang

Jung-hyeon Kim

Hyun-Seop Shim

Jae-Il Lee

Gyu-Yeol Kim

Se-Jang Oh

Chang-Woo Ko

Soon-Geol Hwang

Min-Gu Kim

Hyun-Kyo Seo

Young-Bae Chung

A data line layout includes column selection lines arranged in a first direction at a layer on a memory cell array region, and data lines arranged in the first direction at the layer, the data lines being connected between I/O sense amplifiers and I/O pads.

Area-efficient data line layouts to suppress the degradation of electrical characteristics

An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.

Electrical signal transmission module, method of transmitting electric signals and electrical inspection apparatus having the same

A semiconductor memory device includes a sub memory cell array region having memory cells each connected between word lines extending in a first direction and bit lines extending in a second direction that is orthogonal to the first direction of extension of the word lines and a sub word line driver region disposed at a side of the sub memory cell array region in the first direction and including sub word line drivers that activate the word lines. A sensing region is disposed at a side of the sub memory cell array region in the second direction and including an equalizer that precharges the bit line in response to a signal transferred through a drive signal line and at least one first control signal driver that activates an inverted control signal line in response to a signal transferred through a control signal line. A conjunction region disposed at an intersection between the sub word line driver region and the sensing region, in which the inverted control signal line is connected to the drive signal line.

Semiconductor memory device

A wafer test equipment system includes a performance board connected to a tester head of a tester. A universal block printed circuit board is positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card. A cable assembly transfers the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head. The cable assembly is soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board. A probe card is removably secured to the performance board including the universal block printed circuit board. The probe card includes an interposer on an upper surface thereof, a ceramic multi-layer substrate positioned below the interposer, and a plurality of needles positioned below the ceramic multi-layer substrate on a lower surface thereof opposite the upper surface.

Interface structure of wafer test equipment

An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.

Interposer and probe card having the same

A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.

Wireless interface probe card for high speed one-shot wafer test and semiconductor testing apparatus having the same

There is provided a multilayer type test board assembly for high-precision inspection. The multilayer test board assembly comprises: a plurality of test boards separated from each other according to their functions, having input/output signal terminals, and including at least one test board each having a first section where first mounting devices sensitive to an influence of electrical signals are mounted and a second section where second mounting devices insensitive to an influence of electrical signals are mounted; spacers that arrange the test boards in parallel by spacing apart the test boards by predetermined intervals; connection cables connected to the input/output signal terminals of the test boards; and a signal shielding fence formed on each of the at least one test board so as to protect the first mounting devices from electrical signals generated by the second mounting devices.

Multilayer type test board assembly for high-precision inspection

An electrical test system includes a test head, a performance board, a probe card and coaxial cables. The performance board includes a first side and an opposite second side, where the first side of the performance board is electrically connected to the test head and the second side of the performance board includes first coaxial cable connection portions. The probe card includes a first side and an opposite second side, where the first side of the probe card includes second coaxial cable connection portions and the second side includes a wafer test probes. The coaxial cables respectively electrically connect the first coaxial cable connection portions of the performance board to the second coaxial cable connection portions of the probe card.

Electrical test system including coaxial cables

In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

Growing community of inventors

Yongin-si, South Korea

Young-Soo An