Samsung Electronics Co., Ltd.

Young-Shin Choi

Young-lyong Kim

Chul-Yong Jang

Jong-Gi Lee

Kun-Dae Yeom

Du-San Baek

Seul-Ki Han

Myoun-Kyu Kang

Hyun-Jong Woo

Ki-Bong Mun

An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

Apparatus for combining printed circuit boards

Provided is a printed circuit board having a bump interconnection structure that improves reliability between interconnection layers. Also provided is a method of fabricating the printed circuit board and semiconductor package using the printed circuit board. According to one embodiment, the printed circuit board includes a plurality of bumps formed on a resin layer between a first interconnection layer and a second interconnection layer. The second interconnection layer includes insertion holes corresponding to upper portions of the bumps so that the upper portions of the bumps protrude from the second interconnection layer. The upper portion of at least one of the bumps includes a rivet portion having a diameter greater that the diameter of the corresponding insertion hole to reliably interconnect the first and second interconnection layers.

Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same

Growing community of inventors

Asan-si, South Korea

Young-Shin Choi