Samsung Electronics Co., Ltd.

Young-Seung Cho

Dae-Ik Kim

Seung-Jun Lee

Hyun-Woo Chung

Kyung-Eun Kim

Ji-Young Kim

Yoo-Sang Hwang

Sung-eui Kim

Jong-Bom Seo

Hoon Jeong

Jun-soo Lee

Chan-Won Kim

Yoosang Hwang

Daeik Kim

Yongchul Oh

So-Hyun Park

Sang-Jo Yun

Provided are semiconductor devices and methods of fabricating the same. The semiconductor devices include an interlayer insulating layer on a semiconductor substrate, contact pads on the semiconductor substrate and penetrating the interlayer insulating layer, a stopping insulating layer on the interlayer insulating layer, storage electrodes on the contact pads, upper supporters between upper parts of the storage electrodes, side supporters between the storage electrodes and the upper supporters, a capacitor dielectric layer on the storage electrodes, the side supporters, and the upper supporters, and a plate electrode on the capacitor dielectric layer.

Semiconductor devices having a supporter and methods of fabricating the same

A method of manufacturing a semiconductor device is provided. The method includes sequentially forming a mold layer and a preliminary support layer on a substrate, forming a plurality of lower electrodes through the preliminary support layer and the mold layer, removing a portion of the preliminary support layer between the plurality of lower electrodes to form a preliminary support layer pattern having an open area exposing a top surface of the mold layer, removing the mold layer to form a void between the substrate and the preliminary support layer pattern, filling the open area and the void with a sacrificial layer, and replacing the preliminary support layer pattern with a support pattern.

Semiconductor device including a capacitor and a method of manufacturing the same

A semiconductor device includes a first capacitor structure, a second capacitor structure, and an insulation pattern. The first capacitor structure includes a first lower electrode, a first dielectric layer and a first upper electrode sequentially stacked on a substrate. The second capacitor structure includes a second lower electrode, a second dielectric layer and a second upper electrode sequentially stacked on the substrate, and is adjacent to the first capacitor structure. The insulation pattern partially fills a space between the first and second capacitor structures, and an air gap is formed between the first and second capacitor structures on the insulation pattern.

Semiconductor devices including capacitors and methods of manufacturing the same

Semiconductor devices including capacitors

A method of forming a DRAM can include forming a plurality of transistors arranged in a first direction on a substrate and forming a bit line structure that extends in the first direction, where the bit line structure being electrically coupled to the plurality of transistors at respective locations in the first direction. A plurality of first landing pads an be formed at alternating ones of the respective locations having a first position in a second direction on the substrate. A plurality of second landing pads can be formed at intervening ones of the respective locations between the alternating ones of the respective locations, where the intervening ones of the respective locations having a second position in the second direction on the substrate wherein second position is shifted in the second direction relative to the first position.

Methods of forming positioned landing pads and semiconductor devices including the same

A method of fabricating a semiconductor device including a vertical channel transistor. The method may include: forming a plurality of first device isolation layers in a substrate as a pattern of lines having a first depth from an upper surface of a substrate, to define a plurality of active regions, forming a plurality of trenches having a second depth smaller than the first depth, etching portions of the substrate that are under some of the plurality of trenches that are selected at a predetermined interval, to form a plurality of device isolation trenches having a third depth that is greater than the second depth, forming second device isolation layers that include an insulating material, in lower portions of the plurality of device isolation trenches, and forming buried bit lines in lower portions of the plurality of trenches and the plurality of device isolation trenches.

Method of fabricating semiconductor device including vertical channel transistor

A semiconductor device and method of manufacturing the same. The method includes: defining a first active area and a second active area on a substrate, the first and second active areas being in a line form, forming a first main trench and a second main trench on the substrate, forming a first sub-trench and a second sub-trench in bottoms of the first and second main trenches, respectively, forming a buried insulation layer filling the first and second sub-trenches, partially exposing the substrate at an area where the first active area crosses with the first sub-trench and an area where the second active area crosses with the second sub-trench and forming the first buried bit line and the second buried bit line on the buried insulation layer, and the first and second buried bit lines being extended in parallel to each other.

Semiconductor device having vertical channel transistor and method of manufacturing the same

Provided is a semiconductor device having a vertical channel transistor and method of fabricating the same. The semiconductor device includes first and second field effect transistors, wherein a channel region of the first field effect transistor serves as source/drain electrodes of the second field effect transistor, and a channel region of the second field effect transistor serves as source/drain electrodes of the first field effect transistor.

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Yongin-si, South Korea

Young-Seung Cho