Samsung Electronics Co., Ltd.

Young-seop Rah

Soon-Moon Jung

Jae-hoon Jang

Han-Byung Park

Dong-Hoon Jang

Hee-soo Kang

Young-bae Yoon

Jeong-dong Choe

Jae-Hwang Sim

Young-ho Lee

Jae-Hun Jeong

Jong-Hyuk Kim

Hoo-Sung Cho

Jun-Beom Park

A semiconductor device, including a substrate having first and second active regions, the first and second active regions being disposed on opposite sides of an isolation structure, and a bit line electrically coupled to a contact plug that is on the isolation structure between the first active region and the second active region, and electrically coupled to an active bridge pattern directly contacting at least one of the first and second active regions, wherein the contact plug is electrically coupled to the first active region and the second active region, and a bottom surface of the active bridge pattern is below a top surface of the first and second active regions.

Method of manufacturing semiconductor device having shared bit line structure

Provided are a method of forming patterns for a semiconductor device in which a pattern density is doubled by performing double patterning in a part of a device region while patterns having different widths are being simultaneously formed, and a semiconductor device having a structure to which the method is easily applicable. The semiconductor device includes a plurality of line patterns extending parallel to each other in a first direction. A plurality of first line patterns are alternately selected in a second direction from among the plurality of line patterns and each have a first end existing near the first side. A plurality of second line patterns are alternately selected in the second direction from among the plurality of line patterns and each having a second end existing near the first side. The first line patterns alternate with the second line patterns and the first end of each first line pattern is farther from the first side than the second end of each second line pattern.

Semiconductor devices including patterns

An SRAM device includes a substrate having at least one cell active region in a cell array region and a plurality of peripheral active regions in a peripheral circuit region, a plurality of stacked cell gate patterns in the cell array region, and a plurality of peripheral gate patterns disposed on the peripheral active regions in the peripheral circuit region. Metal silicide layers are disposed on at least one portion of the peripheral gate patterns and on the semiconductor substrate near the peripheral gate patterns, and buried layer patterns are disposed on the peripheral gate patterns and on at least a portion of the metal silicide layers and the portions of the semiconductor substrate near the peripheral gate patterns. An etch stop layer and a protective interlayer-insulating layer are disposed around the peripheral gate patterns and on the cell array region. Methods of forming an SRAM device are also disclosed.

Methods of forming SRAM devices having buried layer patterns

Semiconductor device having shared bit line structure

SRAM devices having buried layer patterns

A semiconductor memory device including a memory cell array, a first row decoder adjacent the memory cell array, and a second row decoder adjacent the memory cell array. A memory cell array may include first and second memory cell blocks on respective first and second semiconductor layers. The first memory cell block may include a first word line coupled to a first row of memory cells on the first semiconductor layer, the second memory cell block may include a second word line coupled to a second row of memory cells on the second semiconductor layer, and the first word line may be between the first and second semiconductor layers. The first row decoder may be configured to control the first word line, and the second row decoder may be configured to control the second word line. A first wiring may electrically connect the first row decoder and the first word line, and a second wiring may electrically connect the second row decoder and the second word line.

Semiconductor device with three-dimensional array structure

A non-volatile memory device includes a semiconductor substrate including a cell array region and a peripheral circuit region. A first cell unit is on the semiconductor substrate in the cell array region, and a cell insulating layer is on the first cell unit. A first active body layer is in the cell insulating layer and over the first cell unit, and a second cell unit is on the first active body layer. The device further includes a peripheral transistor on the semiconductor substrate in the peripheral circuit region. The peripheral transistor has a gate pattern and source/drain regions, and a metal silicide layer is on the gate pattern and/or on the source/drain regions of the peripheral transistor. A peripheral insulating layer is on the metal silicide layer and the peripheral transistor, and an etching protection layer is between the cell insulating layer and the peripheral insulating layer and between the metal silicide layer and the peripheral insulating layer.

Non-volatile memory devices including etching protection layers and methods of forming the same

Growing community of inventors

Gyeonggi-do, South Korea

Young-seop Rah