Samsung Electronics Co., Ltd.

Young-Sang Cho

Hee-Seok Lee

Na-rae Shin

Donghan Kim

Yun-seok Choi

Sang Hun Jeon

Eun-seok Song

Iksung Park

A power supply circuit includes a sequence control circuit configured to generate at least one control signal in response to a main power source, a voltage regulator circuit configured to be coupled to the main power source and to selectively generate at least one power supply voltage for a chipset from the main power source in response to the at least one control signal and a discharge circuit configured to discharge the voltage regulator circuit responsive to the at least one control signal.

Power supply circuits with discharge capability and methods of operating same

A tape distribution substrate comprises a plurality of distribution lines formed on a base film. In one embodiment, the distribution lines comprise data lines arranged in data line pairs, wherein each data line pair carries a data signal with two different polarities. The distance between the data lines in each data line pair becomes narrower as the data lines extend away from the base film. In another embodiment, the distribution lines comprise power distribution lines, each having a body portion including several holes, and divided into one or more sub-power distribution lines connected to the base film.

Tape distribution substrate having pattern for reducing EMI

A semiconductor chip, a tape package of the chip and a tape wiring substrate of the chip may be configured so as to effectively radiate heat generated from the chip externally through certain wiring patterns connected to certain pads. In an example, the chip may include a plurality of input pads along at least one edge of an active surface. The input pads may include power pads and ground pads. The chip may include a plurality of output pads along edges of the active surface, outside of the input pads. The power pads and the ground pads may be located at a central area of the at least one edge.

Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same

A package may include a semiconductor chip mounted on a film substrate. A method of manufacturing the same may involve providing a semiconductor chip. The semiconductor chip may include recesses and bumps. A film substrate including a through hole may be provided. The semiconductor chip may be inserted into the through hole of the film substrate. Circuit wires may be formed on the film substrate to contact the bumps of the semiconductor chip.

Semiconductor package and method of manufacturing the same

An adjustable-inductance (AI) filter, a tape distribution substrate including the filter, and a display panel assembly including the tape distribution substrate are provided. The adjustable-inductance (AI) filter includes a filter distribution line including first and second end portions each having a first line width, at least one repair pattern having a second line width and disposed between the first and second end portions, and at least one unit filter bank connected in parallel to the at least one repair pattern, respectively.

Growing community of inventors

Suwon-si, South Korea

Young-Sang Cho