Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Korea Institute of Science and Technology

Young-sang Cho

Dae-woo Son

Kyong-Soon Cho

Ye-chung Chung

Sang-Heui Lee

Yun-seok Choi

Sa-Yoon Kang

Byung-seo Kim

Kyoung-sei Choi

Si-hoon Lee

Sang-Gui Jo

Chang-Sig Kang

Young-jae Joo

Jeong-kyu Ha

Donghan Kim

Hong-seok Lee

Mi-jeong Song

Su-Yong An

Woo-sung Lee

Sang-Heul Lee

Jae-Ik Kim

Jae-woong Choi

Byung-ok Kang

Jin-Seong Yoon

Jae-Chun Oh

Power management apparatuses are provided. A power management apparatus includes a secondary power device that includes at least one capacitor. The power management apparatus includes a charging circuit that includes a direct current (DC)-DC converter and that is configured to supply power to the secondary power device. Moreover, the power management apparatus includes a measuring circuit that is configured to measure a switching profile of the DC-DC converter, and to determine a state of the secondary power device by comparing at least one time period of the switching profile with a reference time. Related memory systems and methods of operation are also provided.

Memory systems and power management apparatuses including secondary power devices, and related methods of operation

Provided is a semiconductor package including a substrate and a semiconductor chip formed on the substrate. The semiconductor chip may include a chip alignment mark on a surface of the semiconductor chip, and wiring patterns formed on a surface of the substrate, wherein the chip alignment mark is bonded to the wiring patterns. Accordingly, the surface area of the semiconductor chip may be reduced.

Semiconductor package

A semiconductor chip for a TAB package includes a surface including a set of input pads connected to internal circuitry of the chip and for receiving external signals The surface includes output pads. A plurality of input pads are adjacent a first edge and are in a first row substantially parallel to the first edge and extending in a first direction; a plurality of first output pads are adjacent a second edge, and are in a second row substantially parallel to the second edge and extending in the first direction; and a plurality of second output pads are located between the first row and the second row. The plurality of second output pads include first and second outermost pads located a certain distance from a respective third edge and fourth edge, and first and second inner pads located a greater distance from the respective third edge and fourth edge.

Semiconductor chip and film and tab package comprising the chip and film

A semiconductor chip for a tape automated bonding (TAB) package is disclosed. The semiconductor chip comprises a connection surface including a set of input pads connected to internal circuitry of the chip and for conveying external signals to the internal circuitry, the set of input pads comprising all of the input pads on the chip. The connection surface includes a set of output pads connected to internal circuitry of the chip and for conveying internal chip signals to outside the chip, the set of output pads comprising all of the output pads on the chip.

Semiconductor chip and film and TAB package comprising the chip and film

A method for forming colloidal photonic crystals comprises; surrounding an outer circumference of a cylinder with a flexible substrate, spacing the cylinder a predetermined distance from a panel coated with a colloidal solution, and rotating the cylinder to form colloidal photonic crystals on the flexible panel.

Method and apparatus for forming colloidal photonic crystals

Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

The present disclosure relates to a method for removing anions such as nitrate ion, sulfate ion, chloride ion, and phosphate ion existing in underground water, surface water or waste water. The method involves adding alumina cement and a calcium compound to the water containing the anion followed by applying an electric field thereto, thereby forming a chemical precipitate which is an insoluble complex salt. The disclosure also relates to a continuous process for removing the anion by continuously performing the above method for removing anions.

Method for anion removal by forming chemical precipitation under an electric field and continuous process for anion removal

Growing community of inventors

Yongin-si, South Korea

Young-sang Cho