Samsung Electro-Mechanics Co., Ltd.

Samsung Led Co., Ltd.

Samsung Electronics Co., Ltd.

Young Sam Park

Hun Joo Hahm

Hyung Suk Kim

Jung Park

Young June Jeong

Seong Yeon Han

Dae Yeon Kim

Ho Sik Ahn

Kyung Taeg Han

Do Hun Kim

Seon Goo Lee

Chul Hee Yoo

Chang Ho Song

Bum Jin Kim

Dae Hyun Kim

Ho Yeon Kim

In Tae Yeo

Seung Ick Lee

Yoon Sung Na

Chul Soo Yoon

Won Joon Lee

Young Jae Song

Joon Ho Yoon

Chang Wook Kim

Young Geun Jun

Young Sik Jeong

Myoung Soo Choi

Dae Cheon Kim

Jin Mo Kim

Sung A Choi

Ji Hyun Lim

Man Ki Hong

Tae Heon Han

Churl Wung Shin

Young Taek Kim

Dae Woon Hong

Subedi Rabindra

Jeong Eun Lim

Giun Lim

Ho Sik Anh

Jung Kyu Kook

Hyun Bae Park

A light emitting device includes: a substrate; a light emitting element mounted on the substrate and emitting blue light and green light; and a wavelength conversion part wavelength-converting a portion of light emitted from the light emitting element into red light, and including fluoride-based phosphors represented by Chemical Formula: AMF:Mn(2&#x2266;x&#x2266;3 and 4&#x2266;y&#x2266;7, where element A is at least one selected from a group consisting of Li, Na, K, Rb, and Cs and element M is at least one selected from a group consisting of Si, Ti, Zr, Hf, Ge and Sn) and organic or inorganic coating layers enclosing the fluoride-based phosphors.

Light emitting device, backlight unit and display apparatus

A light emitting device package includes a reflective unit having a first surface and a second surface opposing the first surface and having a through hole formed in a central portion of the reflective unit to penetrate through the first and second surfaces, a light emitting device disposed in the through hole and externally exposed to one of the first and second surfaces, and an optical device disposed on the first surface of the reflective unit to cover the light emitting device. The optical device allows light generated by the light emitting device to be partially transmitted and partially reflected to be emitted externally.

Light emitting device package and lighting device having the same

A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram.

White light emitting device and white light source module using the same

A light source module, a backlight unit, a display apparatus, a television set, and an illumination apparatus are provided. The light source module includes: one or more light source units including a light emitting element emitting light when electricity is applied thereto; and an optical sheet disposed above the light source units and exhibiting bidirectional transmittance distribution function characteristics having first and second peaks at radiation angles less than 0&#xb0; and greater than 0&#xb0;.

Light emitting device package, light source module, backlight unit, display apparatus, television set, and illumination apparatus

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Light emitting diode package and fabrication method thereof

There is provided a light emitting diode package and a method of manufacturing the same. A light emitting diode package according to an aspect of the invention may include: an LED chip; a body part having the LED chip mounted thereon; a pair of reflective parts extending from the body part to face each other while interposing the LED chip therebetween, and reflecting light emitted from the LED chip; and a molding part provided between the pair of reflective parts to encapsulate the LED chip and having a top surface whose central region is curved inwards.

Light emitting diode package and method of manufacturing the same

There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.

Light emitting module

There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles &#x3b8; satisfying the condition of 45&#xb0;&#x2266;&#x3b8;&#x2266;55&#xb0; therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P1 between the light emitting device and the light emitting device diagonally across from the light emitting device satisfies the condition of 25 mm&#x2266;P&#x2266;29 mm, and a pitch Pbetween the light emitting device and another light emitting device located in a horizontal direction satisfies the condition of 34 mm&#x2266;P&#x2266;38 mm.

Plane light source and LCD backlight unit having the same

The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity.

Light emitting diode package including a lead frame with a cavity

The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.

LED package and backlight unit using the same

An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.

LED package frame and LED package having the same

Growing community of inventors

Seoul, South Korea

Young Sam Park