Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Kt Corporation

Cj Cheiljedang Corporation

Young Rae Kim

Won Chul Do

Min Hwa Chang

Dong Hyun Kim

Jae Hun Bae

Seok Geun Ahn

Ah Ra Jo

Ji Hun Lee

Min Kyun Yoo

Jong Sik Paek

Doo Hyun Park

Wang Gu Lee

Mi Kyeong Choi

Seo Yeon Ahn

Jin Ryang Hwang

Ronald Patrick Huemoeller

David Jon Hiner

Michael G Kelly

Jung Ho Lee

Min Ho Jung

Seong Min Seo

Sang Mok Lee

Seung Chul Han

Da Eun Kim

Pil Je Sung

Minho Chang

Yong Bum Kim

Jin Hwa Chang

Jung Min Kim

Sun Joo Moon

Jeung Yil Park

JiYoung Chung

DoHyun Na

Joo Hyun Kim

Seok Woo Yun

Hyang Sig Kim

A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a first semiconductor die, and a second semiconductor die. The first semiconductor dies includes high-density bumps and low-density bumps. The second semiconductor die includes high-density bumps and low-density bumps. The high-density bumps of the first semiconductor die and the high-density bumps of the second semiconductor die are electrically connected to the high-density patch. The low-density bumps of the first semiconductor die and the low-density bumps of the second semiconductor die are electrically connected to the low-density substrate.

Semiconductor device and manufacturing method thereof

Semiconductor device

A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.

A method of preparing a low-molecular lignin derivative comprises the step of: preparing lignin by hydrolyzing lignocellulosic biomass with an acid; preparing a first mixture by mixing 100 parts by weight of the lignin and 500 parts or more by weight of a phenolic compound; preparing a second mixture by mixing the first mixture with a solvent including the hydrophobic polar solvent; and recovering a low-molecular lignin derivative from the second mixture.

Method for preparing low-molecular lignin derivative

A semiconductor device with enhanced interposer quality, and method of manufacturing thereof. For example and without limitation, various aspects of the present disclosure provide an interposer die that comprises a first signal distribution structure comprising at least a first dielectric layer and a first conductive layer, wherein the signal distribution structure is protected at lateral edges by a protective layer. Also for example, various aspects of the present disclosure provide a method of manufacturing a semiconductor device comprising such an interposer die.

Electronic device with a plurality of redistribution structures having different respective sizes

A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly.

Various aspects of the present disclosure provide a semiconductor device and a method for manufacturing thereof, which can facilitate stacking of semiconductor die while saving manufacturing cost. In an example embodiment, the semiconductor device may comprise a first semiconductor die, a second semiconductor die bonded to a top surface of the first semiconductor die, and a redistribution layer electrically connecting the first semiconductor die to the second semiconductor die, wherein the redistribution layer is formed to extend along surrounding side portions of the second semiconductor die.

A system for extending coverage of a wireless Internet service by using a mobile communication network is provided. The system includes a wireless access point, a combiner, and a distributor. The combiner is connected to the wireless access point. The combiner includes a filter that isolates a signal band of a wireless Internet signal corresponding to the wireless access point and a signal band of a mobile communication signal corresponding to the mobile communication network. After isolation, the combiner outputs the wireless Internet signal or the mobile communication signal. The distributor is connected to the combiner and at least one antenna. The distributor receives the wireless Internet signal from the combiner and outputs the received wireless Internet signal via the antenna.

System for extending wireless internet coverage

Growing community of inventors

Seoul, South Korea

Young Rae Kim