Samsung Electro-mechanics Co., Ltd.

Young Pyo Lee

Seung Pil Jung

A electronic device module includes a first substrate; electronic devices mounted on the first substrate; a second substrate coupled to a lower surface of the first substrate, the second substrate including a device accommodating portion; a sealing portion configured to seal an electronic device in the device accommodating portion; and an external connection terminal bonded to an electrode pad disposed in a lower surface of the second substrate. Bonding surfaces of the electrode pad and the external connection terminal are disposed on a same plane as a lower surface of the sealing portion.

Electronic component module and method of manufacturing the same

A communications module includes a front-end module including a common port configured to be connected to an antenna, a reception port configured to pass a reception signal, and a transmission port configured to pass a transmission signal, and a high frequency switch circuit connected to the reception port and/or the transmission port and configured to change signal routes for signals passing through the front-end module, wherein the front-end module is configured to amplify communications signals of different communications standards.

Growing community of inventors

Seoul, South Korea

Young Pyo Lee