Samsung Electronics Co., Ltd.

Young-Ok Cho

Sang-Seok Kang

Jun-Bae Kim

Jae-Hoon Joo

Chan-hee Jeon

A semiconductor device and method of forming a pad thereof are provided. The device includes: a substrate; at least one first active region disposed in a first region of the substrate; at least one second active region disposed in a second region adjacent to the first region of the substrate; a plurality of first contacts disposed on the second active region; a first insulating layer disposed on the first active region and between the first contacts; a poly layer disposed on the first contacts and the first insulating layer; a plurality of second contacts disposed on the poly layer in the second region; a second insulating layer disposed between the second contacts and on the poly layer in the first region; and a pad disposed on the second insulating layer and the second contacts.

Semiconductor device and method of arranging pad thereof

Integrated circuit memory devices include first and second memory cell arrays, first and second transmission parts between the first and second memory cell arrays, and first and second input/output selection parts between the first and second memory cell arrays, wherein the first transmission part is adjacent the first input/output selection part and wherein the second transmission part is adjacent the second input/output selection part. A transistor in the first transmission part and a transistor in the first input/output selection part can share a first common source/drain region. A transistor in the second transmission part and a transistor in the second input/output selection part also can share a second common source/drain region. First and second input/output selection parts also may be provided between the first and second transmission parts. At least one sense amplifier part may be provided between the first and second input/output selection parts.

Growing community of inventors

Seongnam-si, South Korea

Young-Ok Cho