Samsung Electronics Co., Ltd.

Seoul National University

Young Mok Son

Sun Hwa Kim

Chan Wook Baik

Jong Min Kim

Joon Yong Park

Han Sol Cho

Gun Sik Park

Jin Kyu So

Anurag Srivastava

Sang Yoon Lee

Yong Jong Park

Jong Seok Kim

Jung Han Shin

Sung Hen Cho

Sun Il Kim

Jin Gyu Choi

Jin Taek Hwang

Yong Young Park

Min Seong Ryu

An electron beam focusing electrode and an electron gun using the same may include a plate having a polygonal through-hole; at least a projecting portion formed on at least one side of the through-hole. By using the electron beam focusing electrode, a spreading phenomenon of an electron beam having a rectangular cross section may be reduced. Further, the output of the electron gun may be increased, and electron beams may be easily focused.

Electron beam focusing electrode and electron gun using the same

The disclosed mold includes recessed parts which have a shape corresponding to embossed portions of the barrier rib to be fabricated, and protruding parts which have a shape corresponding to depressed portions of the barrier rib to be fabricated, protrude adjacent to the recessed parts, and are tapered. The protruding parts and the recessed parts are arranged at regular intervals. It is possible to simply fabricate the two-layered barrier rib for inkjet application through a single embossing process at low cost using the mold for fabricating the barrier rib of the present invention.

Mold for fabricating barrier rib and method of fabricating two-layered barrier rib using same

Provided are a substrate structure and method of forming the same. The method of forming the substrate structure may include etching a substrate to form an etched portion having a vertical surface, forming a diffusion material layer on the whole substrate or in part of the substrate; annealing the diffusion material layer to form a seed layer diffused downward toward the surface of the etched portion, and forming a metal layer on the seed layer. Accordingly, surface characteristics of the etched portion of the substrate may be enhanced by the seed layer, and therefore, a metal layer with improved adhesion and a uniform thickness may be formed on the vertical surface of the etched portion.

Substrate structure and method of forming the same

A method for treating a polymeric optical element which includes the steps of mounting a polymeric optical element into a chamber, injecting a compressed gas as an annealing medium into the chamber and annealing the polymeric optical element and removing the annealing medium from the chamber. The present method provides a new way of preventing disadvantageous molecular orientation and residual stress which causes a deterioration in the optical properties of the polymeric optical element.

Enhancement of optical and mechanical properties in a polymeric optical element by annealing under a compressed gas

A method for forming a pattern of an organic insulating film by forming an electrode on a substrate, coating an imprintable composition thereon to form an organic insulating film, pressurizing and curing the organic insulating film using a patterned mold to transfer a pattern of the mold to the organic insulating film, and etching a portion of the organic insulating film remaining on the electrode. Since a pattern of an organic insulating film can be formed by simple molding without the use of a photoresist, the overall procedure is simplified and eventually an organic thin film transistor with high charge carrier mobility can be fabricated by all wet processes.

Method for forming pattern of organic insulating film

Growing community of inventors

Hwaseong-si, South Korea

Young Mok Son