Samsung Electronics Co., Ltd.

Young-Mok Kim

Jae-hyun Yoo

Sun-hak Lee

Myoung-Kyu Park

Yong-Sang Jeong

Seong-Hun Jang

Kwan-Jae Song

Tae-Cheol Lee

In-Hack Lee

A semiconductor device having a high and stable operating voltage and a method of manufacturing the same, the semiconductor device including: a substrate having an active region including a channel region; a gate insulating layer that covers a top surface of the active region; a gate electrode that covers the gate insulating layer on the top surface of the active region; buried insulating patterns in the channel region of the active region at a lower side of the gate electrode and spaced apart from a top surface of the substrate; and a pair of source/drain regions in the substrate at both sides of each of the buried insulating patterns and extending from the top surface of the substrate to a level lower than that of each of the buried insulating patterns.

Semiconductor device and method of manufacturing the same

A semiconductor device comprises a recessed trench in a substrate, a gate insulating layer including a first portion and a second portion, the first portion having a first thickness and covering lower portions of sidewalls of the recessed trench and a bottom surface of the recessed trench, and the second portion having a second thickness and covering upper portions of the sidewalls of the recessed trench, the second thickness being greater than the first thickness, a gate electrode filling the recessed trench, a first impurity region having a first concentration and disposed at opposing sides of the gate electrode, and a second impurity region having a second concentration greater than the first concentration and disposed on the first impurity region to correspond to the second portion of the gate insulating layer.

Semiconductor device and method of fabricating the same

Provided is a method of fabricating a semiconductor device having a transistor. The method includes forming a first gate trench in a first active region of a semiconductor substrate. A first gate layer partially filling the first gate trench is formed. Ions may be implanted in the first gate layer and in the first active region on both sides of the first gate layer such that the first gate layer becomes a first gate electrode of a first conductivity type and first impurity regions of the first conductivity type are formed on both sides of the first gate electrode.

Method of fabricating semiconductor device having transistor

Growing community of inventors

Suwon-si, South Korea

Young-Mok Kim