Samhwa Capacitor Co., Ltd.

Young Min Yoo

Young Joo Oh

Jung Rag Yoon

Kyung Min Lee

A multi-layer ceramic capacitor assembly includes a first terminal assembly member formed by arranging first protruded members at specific intervals, a second terminal assembly member formed by arranging second protruded members at specific intervals so that they face the respective first protruded members, insulated heat dissipation members supported by the first protruded members and the second protruded members and disposed therein, and multi-layer ceramic capacitors alternately disposed between the insulated heat dissipation members so that each multi-layer ceramic capacitor comes into contact with one side and the other side of each insulated heat dissipation member in a first direction, the end on one side of the multi-layer ceramic capacitor in a second direction orthogonal to the first direction is connected to the first terminal assembly member, and the end on the other side of the multi-layer ceramic capacitor in the second direction is connected to the second terminal assembly member.

Multi-layer ceramic capacitor assembly

A power electronic capacitor module for vehicle that may reduce the number of solderings by inserting and thereby mounting a capacitor between a single pair of bus bars and thereby may simplify an assembly process. The power electronic capacitor module for vehicle may include a single pair of bus bars disposed to be separate from each other and each having an external electrode support member; an insulating support frame formed to expose the external electrode support member and wrap around a single pair of bus bars and thereby support the bus bars; and a capacitor element having a single pair of external electrodes and inserted between a single pair of bus bars to thereby be supported by the bus bars or the external electrode support members and electrically connect the external electrodes to the external electrode support members.

Power electronic capacitor module for vehicle

A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate; a plurality of DC link capacitors connected in parallel to each of the first electrode substrate and the second electrode substrate; a plurality of first Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the DC link capacitors; and a plurality of second Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the first Y-capacitors, thereby achieving a miniaturization and facilitating a fabrication by connecting the plurality of DC link capacitors using the PCB.

Direct current capacitor module

Provided is a package type multilayer thin film capacitor for a high capacitance, including: a capacitance block; a pair of clamp membersandbeing installed on one side and another side of the capacitance block, respectively; a pair of lead membersandbeing installed on the clam membersand, respectively; and a molding memberfilling in the capacitance blockto partially expose each of the pair of lead membersand. The capacitance block may be configured by adhering at least two of a ceramic sintered member, a metal capacitance member, and a thin film capacitance memberusing an insulating adhesive member and thereby disposing the at least two members in a multilayered form. Accordingly, capacitance may increase and mechanical strength may be enhanced.

Package type multi layer thin film capacitor for high capacitance

Provided is a package type multi-layer thin film capacitor for large capacitance, including: a ceramic sintered body formed with slots on one side and another side thereof, respectively; a plurality of first internal electrode layers formed within the ceramic sintered body; a plurality of second internal electrode layers formed within the ceramic sintered body to be positioned between the plurality of first internal electrode layers; a pair of first main connection electrode members inserted into the slots to be connected to the first internal electrode layers or the second internal electrode layers, respectively; a pair of first main lead members inserted into the slots and to be connected to the first main connection electrode members, respectively; and a sealing member sealing the ceramic sintered body to partially expose each of the pair of first main lead members.

Growing community of inventors

Suwon-si, South Korea

Young Min Yoo