Lg Innotek Co., Ltd.

Young Min Moon

Young Jun Cho

Nam Seok Oh

Kyoung Soo Ahn

Kee Youn Jang

Kwang Kyu Choi

Sun Mi Moon

Moo Ryong Park

Jung Ho Lee

Hyun Duck Yang

A lighting device disclosed in an embodiment of the invention includes a heat dissipation plate having a recess portion; a circuit board accommodated in the recess portion of the heat dissipation plate and having pads; a light source portion having bonding pads; connection members respectively connecting between the pads and the bonding pads; and an adhesive member that adheres the light source portion to the heat dissipation plate. The light source portion includes a support member; light emitting devices having light emitting chips and a wavelength conversion layer; and a resin member. Each of the connection members has a ribbon shape, and a width of each of the connection members is more than twice the thickness of each of the connection members, and each of the connection members may include two ends respectively connected to the bonding pads and the pads, and a center portion extending convexly between the two ends.

Lighting module and lighting device comprising same

A lighting device according to an embodiment comprises a substrate, a light emitting device disposed on the substrate, a first reflective member disposed on the substrate, a resin layer disposed on the first reflective member, and a wavelength conversion layer disposed on the resin layer, wherein the resin layer includes a first resin layer, a second resin layer spaced apart from the first resin layer, and a third resin layer disposed between the first and second resin layers; the wavelength conversion layer includes a first wavelength conversion layer disposed on the first resin layer and a second wavelength conversion layer disposed on the second resin layer, and the height of the second resin layer is different from the height of the first resin layer; and the light emitting device may be disposed in a region vertically overlap the second and third resin layers but vertically overlap the first layer.

Lighting device and lamp including same

The lighting device disclosed in the embodiment of the invention includes a substrate; a plurality of light emitting devices disposed on the substrate and emitting light in at least a first direction; a resin layer sealing the plurality of light emitting devices; and an optical member disposed on the resin layer, wherein the resin layer may include a first light blocking portion integrally formed with the resin layer and having a transmittance lower than that of the resin layer on an emission-side region of each of the plurality of light emitting devices.

Lighting apparatus and automotive lamp comprising same

One embodiment comprises first and second light-emitting chips, each comprising: a package body having a cavity; first to fourth lead frames disposed inside the package body; a first semiconductor layer; an active layer; and a second semiconductor layer and emitting light of a different wavelength from each other, wherein each of the first to fourth lead frames comprises: an upper surface part exposed to the cavity; and a side surface part bent from one side portion of the upper surface part and exposed by one surface of the package body. In addition, the first light-emitting chip is disposed on the upper surface part of the first lead frame, and the second light-emitting chip is disposed on the upper surface part of the third lead frame.

Light emitting diode package

Disclosed is a light emitting lamp including a light source module including at least one light source and a light guide layer disposed on a substrate burying the at least one light source, and a housing accommodating the light source module, and the at least one light source includes a body having a cavity, a first lead frame including one end exposed to the cavity and the other end passing through the body and exposed to one surface of the body, a second lead frame including one end exposed to one portion of the surface of the body, the other end exposed to the another portion of the surface of the body, and an intermediate part exposed to the cavity, and at least one light emitting chip including a first semiconductor layer, an active layer and a second semiconductor layer, and disposed on the first lead frame.

Growing community of inventors

Seoul, South Korea

Young Min Moon