Korea Electronics Technology Institute

Sunic Systems, Ltd.

Young Min Im

In Ho Hwang

Young Il Kim

Hyung Man Lee

Myoung Jin Kim

Hwe Kyung Kim

Jung Gyun Lee

Seong Ho Kim

Sun Hyuk Kim

Chang Sik Choi

Myung Jin Kim

Young Jong Lee

An apparatus for depositing an organic material includes: a main chamber; a first substrate loading section in which a first substrate is loaded in the first radial direction and seated; a second substrate loading section in which a second substrate is loaded in the second radial direction and seated; a scanner including a linear organic material deposition source, a source moving means to which the organic material deposition source is coupled to linearly move the organic material deposition source so that the organic material particles are injected onto the surface of the first substrate or the second substrate, and a rotating means for rotating the source moving means; and a scanner moving means for moving the scanner back and forth so that the scanner is positioned in the first deposition region or the second deposition region.

Organic material deposition apparatus, and organic material deposition method using same

Provided are a photoelectric conversion module for direct optical interconnection and a method of manufacturing the same, wherein an optical element array is bonded to a side surface of an IC board having a semiconductor chip mounted thereon and an optical waveguide array is bonded to one end of the optical element array having the other end bonded to the IC board to be optically connected to the optical element array, thereby improving the efficiency of optical coupling between optical elements and optical waveguides, and wherein since the optical coupling between the optical elements and the optical waveguides is realized on the same plane between the optical waveguides having the same array as the optical elements, multi-channel optical coupling can be facilitated to enable easy implementation of an optical design.

Photoelectric conversion module for direct optical interconnection and method of manufacturing the same

The present invention relates to a method of packaging optical parts for optical communication. According to the method of the present invention, there are advantages in that a packaging process for optical parts is automated to improve productivity and to obtain price competitiveness and uniformity of quality, and a high frequency heater for locally transferring heat to only a solder preform is used to minimize thermal deformation of areas except a soldering area, thereby achieving highly reliable packaging of the optical parts.

Method of packaging optical parts for optical communication

The present invention provides an optical signal add/drop apparatus comprising: an optical signal multiplexing/demultiplexing portion comprising a plurality of 2&times;2 channel unit devices which are arranged in a straight line and having first and second dual-core ferrules having two optical fibers disposed to be symmetrical to each other at an identical distance from an optical axis for transmitting optical signals, a wavelength division filter disposed between first and second lenses for selectively transmitting or reflecting only the optical signals having specific wavelengths, first and second grin lenses for collimating or focusing the optical signal transmitted or reflected from said wavelength division filter and then transmitting the signal to the first and second dual-core optical fibers; and a switch module having unit 2&times;2 switches connected to two optical fibers of the second dual-core ferrule of each of the unit devices of said optical signal multiplexing/demultiplexing portion; wherein the switch module can drop simultaneously the optical signals demultiplexed on each of the unit devices or transmit them to the output channels continuously according to the connection state of each of 2&times;2 switches of the switch modules and then transmit them to output channels through each of the unit devices when the optical signals are added.

Optical signal add and drop apparatus

Growing community of inventors

Whaseong-Si, South Korea

Young Min Im