Samsung Electronics Co., Ltd.

Young Kyung Kim

Joon Young Kim

Seog Ho Lim

Jae Jun Bang

Ji Hyun Lim

A resin dispensing apparatus includes a supply unit including a syringe having an internal space configured to hold a phosphor-containing resin. An agitator is disposed in the internal space. The supply unit is configured to rotate at least one of the syringe and the agitator to prevent settling of phosphor contained in the phosphor-containing resin. A discharge unit includes a cylinder having a discharge nozzle through which the phosphor-containing resin, received through a connecting pipe connected to the syringe, is discharged. A piston provides pressure to discharge the phosphor-containing resin through the discharge nozzle inside the cylinder.

Resin dispensing apparatus

A semiconductor light emitting device package may include: a light emitting diode (LED) chip having a first surface on which a first electrode and a second electrode are provided, a second surface opposite the first surface, and a plurality of side surfaces, a lateral wavelength conversion layer disposed on a side surface of the plurality of side surfaces of the LED chip, the lateral wavelength conversion layer comprising a wavelength conversion material, and a reflective layer covering the second surface of the LED chip, the reflective layer being configured to reflect light emitted by the LED chip back towards the LED chip.

Semiconductor light emitting device package and light source module using same

A light source module is provided. The light source module includes a substrate having a first surface on which a circuit portion is disposed, and a second surface disposed opposite thereto. The light source module further includes a plurality of light emitting devices mounted on the first surface of the substrate and electrically connected to the circuit portion, wherein the substrate is provided with a groove portion in the second surface thereof, and has a structure bent along the groove portion.

Light source module and backlight unit having the same

There is provided a copper clad laminate (CCL) including: a metal plate; an insulating layer having a planar area greater than that of the metal plate and laminated on the metal plate; and a copper layer laminated on the insulating layer, wherein edges of the insulating layer extend outwardly beyond edges of the metal plate so that an insulation distance insulating the edges of the metal plate from edges of the copper layer is formed. The insulating layer may include a polyimide layer, and a polyimide bonding layer.

Growing community of inventors

Suwon-si, South Korea

Young Kyung Kim