Samsung Electro-mechanics Co., Ltd.

Cheil Industries Inc.

Young Kyun Lee

Eun Jung Lee

Yoon Kok Park

Myung Gu Kang

Dae Sik Kim

Whan G Kim

Yun Hee Lee

Victor Yurlov

Suk Ku Chang

Won Seok Park

Bok Young Hong

An image correction apparatus includes an image correction processor configured to generate an image intensity gradient for each of areas of a pre-corrected image, generate a weight coefficient that is dependent on the image intensity gradient, generate a correction transfer function in which the weight coefficient is applied, generate an output value of a corrected image from an image intensity by applying the correction transfer function, and generate the corrected image based on the output value.

Image correction apparatus and method

A camera module, an electronic device and a method of operating the same are provided. The camera module includes a lens module including lenses, and a sensor module including an image sensor configured to sense an image input through the lens module and a logic unit configured to process the image from the image sensor and the logic unit stores a lens-customized point spread function pre-estimated to correct blur characteristics of the lenses within the lens module.

Camera module, electronic device, and method of operating the same using pre-estimated lens-customized point spread function (PSF)

An epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition including an epoxy resin, a curing agent, and one or more inorganic fillers, the one or more inorganic fillers including prismatic cristobalite, the prismatic cristobalite being present in the epoxy resin composition in an amount of about 1 to about 50% by weight, based on the total weight of the epoxy resin composition.

Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same

An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of Rthrough R, independently, represents a hydrogen atom or a C-Chydrocarbon group, provided that when Rthrough Rare C-Chydrocarbon groups, Rand R, Rand R, Rand R, Rand R, Rand R, and Rand Rcan be joined to each other to form a cyclic structure.

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

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Seoul, South Korea

Young Kyun Lee