Dongwoo Fine-Chem Co., Ltd.

Young Kyun Hong

Myeong Won Lee

Ki Hwan Kim

Duckkyeom Kim

Duck Kyeom Kim

Geun Wang Ji

Myeongwon Lee

Ki Wan Kim

A color filter-integrated touch sensor is disclosed. The color-filter-integrated touch sensor includes a color filter disposed on a first surface side of a substrate and a touch sensor disposed on a second surface side of the substrate. A manufacturing method thereof is disclosed.

Color filter-integrated touch sensor and manufacturing method therefor

The present invention relates to a flexible color filter integrated with a touch sensor, an organic light-emitting display including the same, and a manufacturing method thereof. The flexible color filter integrated with the touch sensor according to the present invention includes a color filter array formed on one surface of a separation layer, an overcoating layer formed on the color filter array, a touch sensor array formed on the overcoating layer, and a base film formed on the other surface of the separation layer. According to the present invention, a functional film, which is very thin, has high optical and flexible properties, and is formed by integrating a color filter with a touch sensor, and an organic light-emitting display to which the functional film is bonded may be implemented.

Flexible color filter integrated with touch sensor, organic light-emitting display including the same, and manufacturing method thereof

The present invention relates to an apparatus and a method for simultaneously performing delamination and adhesion processes. The apparatus which simultaneously performs delamination and adhesion processes includes: a lower stage configured to suction and fix a carrier substrate on which a first workpiece is adhered; and an upper stage including a curved main body configured to suction and fix a second workpiece and formed in a shape convex toward the first workpiece, and a driving portion configured to rotate the curved main body such that predetermined portions of the second workpiece sequentially come into contact with corresponding predetermined portions of the first workpiece at a predetermined pressure, adhere the second workpiece to the first workpiece, and delaminate the first workpiece from the carrier substrate during an adhesion process. According to the present invention, the required number of detailed processes and a process time are decreased, a yield is increased, and deformation of a workpiece due to a residual stress generated during the adhesion and delamination processes is minimized by the adhesion and delamination processes being performed simultaneously.

Apparatus and method for simultaneously performing delamination and adhesion processes

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Seoul, South Korea

Young Kyun Hong